Package structure, display screen and display device
A technology of encapsulation structure and encapsulation glass, which is applied in the direction of semiconductor devices, electrical components, circuits, etc., to achieve the effects of increasing adhesion, relieving stress, and improving the strength of the screen
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment Construction
[0024] In order to make the above objects, features and advantages of the present invention more comprehensible, specific implementations of the present invention will be described in detail below in conjunction with the accompanying drawings. In the following description, numerous specific details are set forth in order to provide a thorough understanding of the present invention. However, the present invention can be implemented in many other ways different from those described here, and those skilled in the art can make similar improvements without departing from the connotation of the present invention, so the present invention is not limited by the specific embodiments disclosed below.
[0025] See figure 1 and figure 2 , the package structure 100 in one embodiment includes a substrate 110 , a package cover 120 and a package glass frit 130 .
[0026] Wherein, the substrate 110 is used to support the package cover 120 and the display device formed on the substrate 110 ....
PUM
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com