Immersed heat dissipation system and immersed liquid cooling source

A heat dissipation system, immersion technology, applied in the direction of using liquid cooling for modification, cooling/ventilation/heating renovation, electrical components, etc. The effect of avoiding damage to heating devices, reducing load and improving heat dissipation performance

Inactive Publication Date: 2019-09-06
CHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The purpose of the present invention is to provide an immersion liquid cooling source to solve the problem of poor cooling effect of the system caused by the inability of the existing immersion heat dissipation system to control the evaporation pressure in the sealed box; the purpose of the present invention is also to provide a An immersion heat dissipation system to solve the problem that the heat dissipation effect of the existing immersion heat dissipation system is poor and easily leads to damage to the heating element

Method used

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  • Immersed heat dissipation system and immersed liquid cooling source

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Embodiment Construction

[0043] Embodiments of the present invention will be further described below in conjunction with the accompanying drawings.

[0044] The specific embodiment of the immersion cooling system provided by the present invention, such as figure 1As shown, it includes a sealed box and an immersion liquid cooling source connected to the sealed box. The sealed box isolates the surrounding atmosphere and allows operation under variable pressure. The sealed box has an inner cavity for holding the heat exchange medium. A heating device 1 is also installed in the box, and the heating device 1 is immersed in the heat exchange medium. The submerged liquid cooling source includes a cabinet and a condenser 5. The condenser 5 is located outside the cabinet and has a gas pipeline and a liquid return pipeline for connecting with a sealed box to form a heat exchange medium circulation circuit. The gas pipeline has a As for the gas circuit box interface connected with the air outlet of the sealed b...

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Abstract

The invention relates to an immersed heat dissipation system and a immersed liquid cooling source. The immersed heat dissipation system comprises a sealed box body and the immersed liquid cooling source connected with the sealed box body. A cavity containing a heat exchange medium is arranged in the sealed box body. A heat generating device is installed in the sealed box body. The immersed liquidcooling source comprises a condenser. The condenser is provided with a gas pipeline and a liquid return pipeline which are used for connecting with the sealed box body to form a heat exchange medium circulation circuit. The gas pipeline is provided with a gas path box body interface for connecting with the gas outlet of the sealed box body. The liquid return pipeline is provided with a liquid pathbox body interface for connecting with the liquid inlet of the sealed box body. A pump is connected in series on the gas pipeline. The immersed heat dissipation system uses the immersed liquid cooling source so as to effectively control the pressure in the system and thus ensure the heat dissipation effect of the system.

Description

technical field [0001] The invention relates to an immersion heat dissipation system and an immersion liquid cooling source. Background technique [0002] Liquid cooling technology can be divided into two modes: cold plate liquid cooling (indirect cooling) and immersion liquid cooling (direct cooling). Immersion liquid cooling, also known as immersion cooling, is a technique used to cool electronic processing equipment, especially for high-speed and high-data-capacity processing equipment, where traditional air cooling has been found to be insufficient. Immersion cooling involves immersing equipment (such as electronic data processing modules) in a tank containing a liquid, using convection and evaporation of the liquid to provide very high cooling rates to keep the module within its normal operating range. [0003] In the prior art, there is an immersion cooling device for electronic equipment, such as the immersion cooling disclosed in the Chinese invention patent applica...

Claims

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Application Information

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IPC IPC(8): H05K7/20
CPCH05K7/203H05K7/20309H05K7/20318
Inventor董永申魏鹏黄胜利陈宁高明王生广田野
OwnerCHINA AVIATION OPTICAL-ELECTRICAL TECH CO LTD