A connection process between a p21 light bulb base and a bulb body

Abstract

The invention discloses a connection process between a P21 light bulb base and a bulb body, comprising the following steps: (a) mounting the lamp base shell on a welding mud molding tool; Soldering mud, soldering paste flows out from the molding tooling and is distributed in a circular shape with a gap in the lamp cap shell (c) Take off the molding core, then remove the lamp cap shell from the molding tooling, and put the bulb body The tail is inserted into the lamp holder shell, and the filament guide wire of the bulb body passes through the soldering port; (d) Bake the lamp holder shell on a firework at 195~205°C for 50~70 seconds to solidify the solder paste, and then solder The mouth is soldered and sealed to form a conductive contact, and the conductive contact is connected to the filament guide wire. This process can not only ensure the firm connection between the bubble body and the lamp holder, but also avoid the influence of volatile gas when soldering after baking, so that no bubbles remain in the solder joints, and the yield rate is improved.

Description

technical field [0001] The invention relates to a light bulb manufacturing process, in particular to a connection process between a P21 light bulb base and a bulb body. Background technique [0002] P21 type bulbs are commonly used in brake lights of automobiles. When making the bulbs, the bulb body of the bulb needs to be bonded to the lamp holder. Wherein, the lamp cap is a cylindrical metal shell with an opening at the upper end for inserting the tail of the bulb into the shell, and a circular opening at the lower end for forming metal conductive solder joints by soldering. When bonding, it is necessary to apply solder paste in the lamp cap in advance, then insert the tail of the bulb body, and then bake the solder paste to solidify, so that the lamp cap and the bulb body are bonded together, and then the tail of the lamp cap can be soldered . When curing, the temperature needs to be heated to about 200°C, and the existing technology is to smear a circle of welding past...

AI Technical Summary

Problems solved by technology

The raw materials of the solder paste contain volatile organic substances such as ethanol, which evaporate in the form of gas during baking and solidification. Because the welding paste has sealed the joint between the lamp cap and the bubble body, most of the volatilized gas in the welding paste will come from the The round hole at the end of the lamp head escapes outwards, which causes the volatilized gas to easily form bubbles in the solder joints during the subsequent soldering process, resulting in defective products

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