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A quantum dot-based packaging structure and display

A technology of encapsulation structure and quantum dots, which is applied in the direction of semiconductor devices, electrical solid devices, electrical components, etc., can solve problems such as uneven color display, and achieve the effect of eliminating coffee ring effect, low processing cost, and low cost

Active Publication Date: 2021-04-06
SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] The purpose of the present invention is to provide a packaging structure and display based on quantum dots, which aims to solve the technical problem in the prior art that the coffee ring effect is likely to occur when quantum dots are inkjet printed on Micro LEDs, resulting in uneven color display.

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  • A quantum dot-based packaging structure and display
  • A quantum dot-based packaging structure and display
  • A quantum dot-based packaging structure and display

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Embodiment Construction

[0032]Embodiments of the present invention will be described in detail below, and examples of the embodiments are illustrated in the drawings, in which the same or similar reference numerals represent the same or similar elements or elements having the same or similar functions. The following is exemplary, and is intended to be used to illustrate the invention without understanding the limitation of the invention.

[0033]In the description of the present invention, it is to be understood that the terms "length", "width", "upper", "lower", "front", "post", "left", "right", "vertical", The orientation of the "horizontal", "top", "bottom", "inside", "outside", etc., is based on the orientation or positional relationship shown in the drawings, is only for ease of describing the invention and simplified description, not Indicating or implying that the device or element must have a specific orientation, constructed and operated in a particular orientation, and thus is not to be construed as...

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Abstract

The present invention relates to the field of packaging technology, and provides a packaging structure based on quantum dots, including a light source board and a plurality of chips arranged on the light source board, and also includes quantum dots and a photoresist layer that has adsorption force for quantum dots. The photoresist layer is arranged on the light-emitting side of each chip, and a plurality of through grooves are arranged on the photoresist layer, and each through groove is arranged in one-to-one correspondence with each chip, and the top of the chip is connected to the bottom end of the through groove and sealed. The quantum dots are coated on the top of the chip and accommodated in the through groove. The present invention also provides a display including a quantum dot-based encapsulation structure. By setting a photoresist layer with a through groove on the chip, the chip and the through groove are arranged in one-to-one correspondence, and the top of the chip is connected and sealed at the bottom of the through groove, so that the adsorption force of the side wall of the through groove can effectively balance the quantum dot itself. The fluid force, thereby eliminating the coffee ring effect, makes the quantum dots in the channel more evenly distributed, thereby achieving uniform color display.

Description

Technical field[0001]The present invention relates to the field of packaging techniques, in particular to a packaging structure and a display based on quantum dots.Background technique[0002]As a new generation of display technologies, Micro LEDs have higher color saturation relative to traditional LCD (liquid crystal) and OLEDs, and luminous efficiency is better, low power consumption. The display of Micro LEDs usually has two programs, where the first is to combine the red-green (RGB) three-color LED unit on the panel, but the drive circuit is more complicated, the manufacturing is difficult, and the working voltage of the red-green LED is different. The attenuation rate is also different, and the reliability is alternative; the second is to ink the printing light conversion material on the micro LED chip typically less than 50 microns, and generate red green blue three-color light by exciting the light conversion material, thereby achieving full color display Among them, the optic...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01L33/50H01L27/15
CPCH01L27/156H01L33/501H01L33/505H01L2933/0041
Inventor 王新中赵志力王恺孙小卫陈明祥
Owner SHENZHEN INSTITUTE OF INFORMATION TECHNOLOGY
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