Radiation unit and array antenna

A technology of radiating elements and dielectric substrates, applied in antennas, structural forms of radiating elements, antenna arrays that are energized separately, etc., can solve problems such as complex assembly and heavy radiating elements, and achieve weight reduction, height reduction, and significant weight reduction Effect

Inactive Publication Date: 2019-11-05
WUHAN HONGXIN TELECOMM TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] In view of the above-mentioned technical defects and application requirements, this application proposes a radiating unit and an array antenna to solve the problems of heavy weight and complicated assembly of the existing radiating unit

Method used

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  • Radiation unit and array antenna
  • Radiation unit and array antenna
  • Radiation unit and array antenna

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Embodiment Construction

[0033] In order to make the objectives, technical solutions, and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be described clearly and completely in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of the embodiments of the present invention, not all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative work shall fall within the protection scope of the present invention.

[0034] Such as figure 1 with figure 2 As shown, the radiation unit provided by the embodiment of the present invention includes: a first dielectric substrate 001 and a second dielectric substrate 003 at different heights; a guide sheet 006 is attached to the upper surface of the first dielectric substrate, and the second The upper su...

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Abstract

The invention relates to the technical field of wireless communication base station antennas, and provides a radiation unit and an array antenna. The radiation unit includes a first dielectric substrate and a second dielectric substrate. A first support column is arranged between the two dielectric substrates. The lower surface of the second dielectric substrate is connected with a second supportcolumn. A guide sheet is attached to the upper surface of the first dielectric substrate, and a radiation sheet is attached to the upper surface of the second dielectric substrate. Feeding circuits are arranged on the lower surface of the second dielectric substrate, and the feeding circuits extend along the second support column to a welding part connected with the second support column. The first dielectric substrate, the first support column, the second dielectric substrate, the second support column and the welding part are integrally formed. The integrally formed radiation unit in the form of a double-layer micro-strip patch has a height of less than 0.18lambda and good low profile characteristic. The height and weight of the radiation unit are reduced, and the reliability and batch consistency of the radiation unit are improved. The radiation unit is suitable for large-scale manufacturing and has an excellent lightweight effect.

Description

Technical field [0001] The present invention relates to the technical field of wireless communication base station antennas, in particular to a radiating unit and an array antenna. Background technique [0002] Mobile communication technology is developing rapidly. The fifth-generation mobile communication technology uses large-scale antenna array technology and is developing towards integration. Because the large-scale array antenna uses a large number of radiating elements and the layout is dense, the radiating elements are required to be lightweight, low-profile, simple in structure and easy to install. [0003] The existing radiating units for base station antennas mainly adopt the following implementation schemes: the first type uses half-wave or full-wave units, plastic injection molding or metal die-casting. Generally, this scheme requires a balun of λ / 4, and the profile Higher; the second type uses a microstrip radiating element to achieve dual polarization through couplin...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01Q1/38H01Q1/50H01Q21/06H01Q1/24
CPCH01Q1/246H01Q1/38H01Q1/50H01Q21/061
Inventor 潘波骆胜军程季熊锡刚
Owner WUHAN HONGXIN TELECOMM TECH CO LTD
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