Glued sample manufacturing equipment and method

Abstract

The embodiment of the invention provides a piece of glued sample manufacturing equipment and method. The equipment comprises a first clamp, a second clamp, a first displacement sensor, a pressure sensor, a sliding device, and a control device. The second clamp is connected with the sliding device, and can slide in the vertical direction along with the sliding device. The pressure sensor is connected with the first clamp. The first displacement sensor is used for monitoring the first clamp or a gluing piece. The control device is connected with the first displacement sensor, the pressure sensorand the sliding device. In the embodiment of the invention, the controller makes the gluing piece move towards a glued piece through the sliding device, the thickness of a glue layer of a glued sample is determined through the displacement sensor, and whether the glue layer between the glued piece and the glued piece is filled or not is judged according to the pressure, monitored by the pressuresensor, borne by the first clamp. The precision of the obtained glued sample is higher, and the gluing effect of the glued sample is better. It is guaranteed that a test can be smoothly conducted.

Description

technical field [0001] The invention relates to the field of scientific research and test auxiliary equipment, in particular to an adhesive sample production equipment and method. Background technique [0002] Adhesive bonded samples refer to the bonding of standard size metal or non-metallic samples through adhesives according to a certain relative positional relationship to form standard bonded joints, which are used for bonding mechanical tests to obtain bonding performance parameters. The production of traditional single-lap adhesive joints usually uses standard gaskets to control the thickness of the adhesive layer, and manually fixes and adjusts the relative position and size of the lap joint samples. The dimensional accuracy is poor, and the consistency of the samples used for repeated tests is also poor. Especially for the micron-level adhesive layer thickness, it is difficult to control the error accuracy at the micron level for manual bonding, which leads to unsati...

AI Technical Summary

Problems solved by technology

[0004] The technical purpose to be achieved by the embodiments of the present invention is to provide a glued sample production equipment and method to solve the problem that the thickness of the precision glued glue layer is difficult to accurately control when making glued samples.

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