Connection device between circuit networks, implementation method, equipment and storage medium

A connection device and network connection technology, which is applied in the direction of electrical connection of printed components, formation of electrical connection of printed components, printed circuits, etc., can solve the problems of components occupying PCB layout space, increase design difficulty, increase material cost, etc., and achieve low design difficulty , easy to design and modify layout, simple structure effect

Pending Publication Date: 2020-01-21
ZTE CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although the reliability of the connection can be guaranteed, it will increase the material cost, and the components occupy the PCB layout space, which increases the design difficulty, especially for the HDI board of smart devices, the design requirements are higher and the difficulty is greater

Method used

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  • Connection device between circuit networks, implementation method, equipment and storage medium
  • Connection device between circuit networks, implementation method, equipment and storage medium
  • Connection device between circuit networks, implementation method, equipment and storage medium

Examples

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Embodiment Construction

[0031] On the PCB board of various electronic products, according to the requirements of the circuit function, the PCB wiring must meet a specific topology. Single-point grounding is required between the grounds; usually PCB traces use components such as zero-ohm resistors, magnetic beads or inductors to short-circuit the network according to the topology requirements, and then complete the wiring of a branch; although these short-circuit components ensure that the PCB traces are correct topology, but will increase the material cost of the product.

[0032] On the HDI board of the smart terminal, a large number of short-circuit components such as resistors, magnetic beads or inductors are also used to short-circuit various networks; however, due to the high layout and wiring density of the HDI board, these short-circuit components are not only The material cost of the product is increased, and a large amount of PCB layout space is also occupied, which increases the difficulty ...

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Abstract

The embodiment of the invention discloses a connection device between circuit networks, an implementation method, equipment and a storage medium. The connection device is PCB packaging. The PCB packaging comprises N terminals which are mutually conducted, and the N is an integer which is greater than or equal to 2. Each of the N terminals is located on a wiring layer of an inner layer of a PCB. Each terminal comprises a bonding pad or a hole disc, and a size of the bonding pad or the hole disc is determined according to a wiring width or a via hole diameter at a connection point. The N terminals are used for connecting different circuit networks through the connection point. And the connecting point comprises wiring or a via hole.

Description

technical field [0001] The present invention relates to electronic circuit technology, and relates to but not limited to a connection device between circuit networks, a realization method, equipment, and a storage medium. Background technique [0002] Printed Circuit Board (PCB) is an important electronic component in electronic circuit technology, a support for electronic components, and a carrier for electrical connections of electronic components. Because it is made using electronic printing, it is called a "printed" circuit board. [0003] High Density Interconnector (HDI) is a production technology of printed circuit boards, a circuit board with relatively high circuit distribution density using micro-blind buried hole technology. HDI is a compact product specially designed for small capacity users. It adopts a modular design that can be connected in parallel, and has a full-range adaptive load capacity and a strong short-term overload capacity. [0004] According to...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): H05K1/11H05K3/42
CPCH05K1/116H05K3/429H05K2201/09427H05K2201/09454
Inventor李学广韩科
OwnerZTE CORP