Probe card

A probe card and probe technology, applied in the field of probe cards, can solve the problems of impedance mismatch, affecting the test quality of Netcom integrated circuits, increasing energy loss, etc.

Pending Publication Date: 2020-09-29
MICROELECTRONICS TECH INC +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

Generally speaking, the probe arrangement of the probe head needs to be designed according to the circuit layout of the customer's DUT. However, in the high-speed test of Netcom integr...

Method used

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Examples

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Embodiment Construction

[0061] A number of embodiments of the present invention will be disclosed below with the accompanying drawings. For the sake of clarity, many practical details will be described together in the following description. It should be understood, however, that these practical details should not be used to limit the invention. That is, in some embodiments of the present invention, these practical details are unnecessary. In addition, for the sake of simplifying the drawings, some known and conventional structures and elements will be shown in a simple and schematic manner in the drawings. And if practically possible, the features of different embodiments can be used interchangeably.

[0062] Please refer to figure 1 , which is a schematic cross-sectional view illustrating the probe card 100 according to an embodiment of the present invention. In this embodiment, if figure 1 As shown, a probe card 100 includes a space transformer 110, a printed circuit board 130 electrically conn...

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Abstract

The invention provides a probe card. The probe card comprises a space converter and a probe head. A plurality of metal pads and a plurality of metal-pad-free areas are formed on a first surface of thespace converter. The probe head is arranged on the first surface of the space converter. The probe head comprises an upper guide plate, a lower guide plate, a plurality of signal probes, a pluralityof grounding probes, a plurality of simulation probes, a plurality of metal layers and a plurality of metal opening areas. Each signal probe and each grounding probe penetrate through and protrude outof the upper guide plate and the lower guide plate so as to be electrically connected with the metal pads of the space converter respectively, each simulation probe penetrates through and does not need to protrude out of the lower guide plate, each simulation probe is electrically connected with each grounding probe, and the simulation probe is arranged in the metal-pad-free area of the space converter so as to improve test quality of the probe card.

Description

technical field [0001] The present invention relates to a probe card, in particular to a vertical spring probe card. Background technique [0002] The main function of the probe card is to directly contact the pads or bumps on the object under test (such as an unpackaged chip or die) through its probes, and achieve the purpose of measurement by cooperating with peripheral testing machines and software control , and further screen out defective products. Usually, the test signal is sent through the test machine, and then sent to the object under test through the probe card, and then the test result signal is sent back by the object under test, and then analyzed by the probe card to the test machine. [0003] The probe head of the traditional probe card is a structure with multiple probes electrically connected. Generally speaking, the probe arrangement of the probe head needs to be designed according to the circuit layout of the customer's DUT. However, in the high-speed te...

Claims

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Application Information

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IPC IPC(8): G01R1/073
CPCG01R1/07314G01R1/0735
Inventor 周嘉南魏豪郑仰宏宋海永李政
Owner MICROELECTRONICS TECH INC
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