Probe card

Abstract

The invention provides a probe card. The probe card comprises a space converter and a probe head. A plurality of metal pads and a plurality of metal-pad-free areas are formed on a first surface of thespace converter. The probe head is arranged on the first surface of the space converter. The probe head comprises an upper guide plate, a lower guide plate, a plurality of signal probes, a pluralityof grounding probes, a plurality of simulation probes, a plurality of metal layers and a plurality of metal opening areas. Each signal probe and each grounding probe penetrate through and protrude outof the upper guide plate and the lower guide plate so as to be electrically connected with the metal pads of the space converter respectively, each simulation probe penetrates through and does not need to protrude out of the lower guide plate, each simulation probe is electrically connected with each grounding probe, and the simulation probe is arranged in the metal-pad-free area of the space converter so as to improve test quality of the probe card.

Description

technical field [0001] The present invention relates to a probe card, in particular to a vertical spring probe card. Background technique [0002] The main function of the probe card is to directly contact the pads or bumps on the object under test (such as an unpackaged chip or die) through its probes, and achieve the purpose of measurement by cooperating with peripheral testing machines and software control , and further screen out defective products. Usually, the test signal is sent through the test machine, and then sent to the object under test through the probe card, and then the test result signal is sent back by the object under test, and then analyzed by the probe card to the test machine. [0003] The probe head of the traditional probe card is a structure with multiple probes electrically connected. Generally speaking, the probe arrangement of the probe head needs to be designed according to the circuit layout of the customer's DUT. However, in the high-speed te...

AI Technical Summary

Problems solved by technology

Generally speaking, the probe arrangement of the probe head needs to be designed according to the circuit layout of the customer's DUT. However, in the high-speed test of Netcom integrated circuits, such a probe arrangement design may often cause impedance mismatch. As a result, energy loss is increased, which in turn affects the test quality of Netcom integrated circuits

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