Integrated miniature radiator and radiating system

Abstract

The embodiment of the invention provides an integrated miniature radiator and a radiating system, wherein the integrated miniature radiator comprises a plate-shaped shell provided with a cooling liquid inlet and a cooling liquid outlet, a plurality of parallel micro-channels are arranged in the shell, one end of each parallel micro-channel is communicated with the cooling liquid inlet, and the other end of each parallel micro-channel is communicated with the cooling liquid outlet; a plurality of non-return type vortex generating structures are arranged in each parallel micro-channel along theflowing direction of the cooling liquid, and the sectional areas of the non-return type vortex generating structures are gradually increased along the flowing direction of the cooling liquid; a piezoelectric vibrator is embedded in the plate face of one side of the shell so as to apply reciprocating pressure to the cooling liquid in the parallel micro-channels. According to the integrated miniature radiator, the integration level of an electronic device micro-channel liquid cooling heat dissipation system is effectively improved, the maintenance and replacement difficulty of parts of the heatdissipation system is reduced, meanwhile, stronger periodic oscillation is generated in the parallel micro-channels through the periodic pulsation effect generated by the piezoelectric vibrators, andthe heat transfer effect is improved.

Description

technical field [0001] The invention relates to the technical field of heat dissipation equipment for electronic devices, in particular to an integrated miniature radiator and a heat dissipation system. Background technique [0002] With the development of high-power electronic components in recent years, coupled with the progress of semiconductor manufacturing technology, many electronic products are now developing towards high performance, light weight, and miniaturization. At the same time, with the continuous increase of packaging density and power consumption of electronic components, on the one hand, their working performance and computing speed are improved, but on the other hand, high power consumption will generate higher heat, and high-density packaging will distribute these heat On the surface of smaller devices, therefore, the heat flux of electronic components is also increasing rapidly, and the heat flux of the new generation of electronic equipment has reached...

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Problems solved by technology

[0004] The embodiment of the present invention provides an integrated micro radiator and heat dissipation system, which is used to solve the problem that the microchannel heat dissipation system in the prior art needs to reserve an installation location for the drive pump, which increases the difficulty of installation and maintenance, and improves the integration of the system Level

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