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Packaging equipment for integrated circuit box

A technology for integrated circuit boxes and packaging equipment, which is applied in the manufacture of circuits, electrical components, semiconductors/solid-state devices, etc. It can solve the problems of low automation, low production efficiency, and large manual labor, so as to reduce manual operations and improve packaging quality. , Realize the effect of automatic loading and unloading

Inactive Publication Date: 2021-01-08
李俊全
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In order to overcome the above-mentioned defects of the prior art, an embodiment of the present invention provides a packaging device for an integrated circuit box. The problem to be solved by the present invention is: the packaging process of the existing integrated circuit box mainly uses manual or semi-automatic equipment to carry out each process Product processing, low production efficiency, large manual labor force, low degree of automation

Method used

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  • Packaging equipment for integrated circuit box
  • Packaging equipment for integrated circuit box
  • Packaging equipment for integrated circuit box

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Embodiment Construction

[0030] The following will clearly and completely describe the technical solutions in the embodiments of the present invention with reference to the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only some, not all, embodiments of the present invention. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0031]The packaging equipment for integrated circuit boxes according to an embodiment of the present invention includes a packaging table 1, a packaging frame 2 and a support frame 3, the packaging frame 2 and the support frame 3 are located above the packaging table 1, and the packaging frame 2 is located Between the support frames 3, a working tank 4 is provided inside the packaging outer frame 2, and a material shifting mechanism 5, a glue coating mechanism ...

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Abstract

The invention discloses packaging equipment for an integrated circuit box, and particularly relates to the field of integrated circuit box processing equipment. The packaging equipment comprises a packaging table, a packaging outer frame and support frames, and is characterized in that the packaging outer frame and the support frame are both located over the packaging table, the packaging outer frame is located between the support frames, and a working groove is formed in the packaging outer frame; and a material moving mechanism, a gluing mechanism and a cover pressing mechanism are arrangedin the working groove, the material moving mechanism comprises a groove wheel shaft and a groove wheel, the groove wheel is rotationally connected with the packaging table through the groove wheel shaft, and the groove wheel comprises a first groove wheel piece, a second groove wheel piece, a third groove wheel piece, a fourth groove wheel piece and a fifth groove wheel piece. Through arrangementof the material moving mechanism, the gluing mechanism, the cover pressing mechanism and the material pushing mechanism, automatic packaging of the integrated circuit box can be achieved, the packaging efficiency is high, the packaging quality is good, automatic feeding and discharging can be achieved, the automation degree of the packaging equipment is enhanced, and the use practicability and convenience of the packaging equipment are improved.

Description

technical field [0001] The invention relates to the technical field of integrated circuit box processing equipment, and more specifically, the invention relates to an integrated circuit box packaging equipment. Background technique [0002] Integrated circuits use semiconductor manufacturing technology to manufacture many transistors, resistors, capacitors and other components on a small single crystal silicon chip, and combine the components into a complete electronic circuit according to the method of multi-layer wiring or tunnel wiring. circuit. Generally, in order to prevent the integrated circuit from being interfered by external factors during use, an integrated circuit box is installed outside the integrated circuit, so that the effect of sealing protection can be achieved. [0003] Integrated circuit boxes usually need to be packaged during the processing process. The packaging process is one of the main processes in the manufacture of integrated circuit boxes. The ...

Claims

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Application Information

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IPC IPC(8): H01L21/67
CPCH01L21/67121
Inventor 李俊全
Owner 李俊全
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