Cable assembly, signal transmission structure and electronic equipment

A signal transmission and cable assembly technology, applied in the information field, can solve the problems of increased signal transmission rate, large signal transmission loss and high cost

Pending Publication Date: 2021-09-14
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, wiring needs to be carried out inside the circuit board, which puts higher requirements on the grade of the circuit board, and the cost of the product is relatively high
In addition, the signal transmission loss of the internal wiring of the circuit board is large, which seriously restricts the improvement of the signal transmission rate.

Method used

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  • Cable assembly, signal transmission structure and electronic equipment
  • Cable assembly, signal transmission structure and electronic equipment
  • Cable assembly, signal transmission structure and electronic equipment

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Embodiment Construction

[0062] In order to make the objectives, technical solutions and advantages of the present application clearer, the present application will be further described in detail below with reference to the accompanying drawings.

[0063] The terminology used in the following embodiments is for the purpose of describing particular embodiments only, and is not intended to be limiting of the present application. As used in the specification of this application and the appended claims, the singular expressions "a," "an," "the," "above," "the," and "the" are intended to also Expressions such as "one or more" are included unless the context clearly dictates otherwise.

[0064] References in this specification to "one embodiment" or "some embodiments" and the like mean that a particular feature, structure, or characteristic described in connection with the embodiment is included in one or more embodiments of the present application. Thus, appearances of the phrases "in one embodiment," "in...

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PUM

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Abstract

The invention provides a cable assembly, a signal transmission structure and electronic equipment. The signal transmission structure comprises a circuit board, a chip and a cable assembly, the chip is assembled on one side of the circuit board, and the cable assembly is assembled on the other side of the circuit board. The cable assembly comprises a cable, the circuit board comprises a plurality of conductive holes, and the chip is electrically connected with the cable of the cable assembly through the conductive holes, so signals of the chip can be transmitted through the cable. According to the technical scheme, large-area wiring does not need to be arranged in the circuit board, the requirement for the loss resistance of PCB is low, the requirement for the grade of the PCB can be lowered, and then the material cost is lowered. In addition, the signal transmission rate of the cable is much higher than the signal transmission rate of the wiring in the circuit board, and remote signal transmission is also facilitated. Therefore, according to the scheme, the product cost is reduced, the application range of communication equipment is expanded, and the high-speed performance of the product is improved.

Description

technical field [0001] The present application relates to the field of information technology, and in particular, to a cable assembly, a signal transmission structure and an electronic device. Background technique [0002] As the communication system has higher and higher requirements for signal transmission rates, the limitations of traditional signal transmission schemes are becoming more and more prominent, and a new architecture design is required to match the requirements of high transmission rates. In a conventional signal transmission structure, a circuit board (PCB), chip components mounted on the circuit board, and connectors are usually included. The chip is used as the core component. In one technical solution, the chip is welded on the surface of the circuit board through BGA (Ball Grid Array). figure 1 It is a schematic structural diagram of a signal transmission structure in the prior art. like figure 1 As shown, the signal inside the chip 1 is transmitted t...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K1/02H05K1/11H05K1/18
CPCH05K1/0245H05K1/181H05K1/119H05K1/112H05K2201/10901H05K2201/09509H05K1/184H05K1/116H05K2201/10356H01R13/24H01R12/7076H01R12/714
Inventor 张国栋陈冲张键向少勇曲志军孙长幸
Owner HUAWEI TECH CO LTD
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