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Electronic equipment

A technology of electronic equipment and lens, which is applied in sub-office equipment, electrical equipment structural parts, telephone communication, etc., can solve the problems of low heat dissipation efficiency, achieve the effects of improving heat dissipation efficiency, avoiding untimely heat dissipation, and reducing thickness

Pending Publication Date: 2021-12-17
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Passive heat dissipation has the problem of low heat dissipation efficiency

Method used

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  • Electronic equipment
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Embodiment Construction

[0024] Example embodiments will now be described more fully with reference to the accompanying drawings. Example embodiments may, however, be embodied in many forms and should not be construed as limited to the embodiments set forth herein; rather, these embodiments are provided so that this disclosure will be thorough and complete, and will fully convey the concept of example embodiments to those skilled in the art. The same reference numerals in the drawings denote the same or similar structures, and thus their detailed descriptions will be omitted.

[0025] Although relative terms such as "upper" and "lower" are used in this specification to describe the relative relationship of one component of an icon to another component, these terms are used in this specification only for convenience, for example, according to the description in the accompanying drawings directions for the example described above. It will be appreciated that if the illustrated device is turned over so...

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Abstract

The invention relates to the technical field of heat dissipation, in particular to electronic equipment which comprises a rear cover and a fan, the rear cover comprises a cover body and a lens decorating part, a lens area is arranged on the cover body, the lens decorating part is arranged in the lens area, and a containing hole is formed in the rear cover; and the fan is arranged in the accommodating hole and is used for cooling the electronic equipment. The heat dissipation efficiency of the electronic equipment can be improved.

Description

technical field [0001] The present disclosure relates to the technical field of heat dissipation, and in particular, to an electronic device. Background technique [0002] With the development and progress of technology, people put forward higher requirements for the functions of electronic equipment. With the improvement of the functions of electronic equipment, the heat generation of each device in the electronic equipment also increases. When the heat generated by the electronic equipment is too large and the heat dissipation performance of the electronic equipment is poor, the temperature of the electronic equipment will rise. Excessive temperature will not only affect the performance of the electronic equipment, but also cause a greater safety hazard in the electronic equipment. At present, electronic devices such as mobile phones mainly dissipate heat through passive heat dissipation, for example, passively dissipate heat by arranging heat sinks on the electronic devi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04M1/02H04M1/18H05K7/20
CPCH04M1/026H05K7/20172H05K7/20136
Inventor 乔波
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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