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Packaging chip, circuit board assembly and electronic equipment

A chip and chip packaging technology, which is applied in the field of packaging chips, circuit board components and electronic equipment, can solve problems affecting chip performance and achieve the effect of improving voltage drop and reducing power loss

Pending Publication Date: 2022-03-04
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The power gating technology can be applied to the chip to improve the leakage power consumption of the chip. However, in the related art, the introduction of the power gating technology leads to an increase in the voltage drop (IR drop) of the chip, which affects the performance of the chip. Therefore, How to improve the voltage drop of the chip has become a technical problem to be solved

Method used

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  • Packaging chip, circuit board assembly and electronic equipment
  • Packaging chip, circuit board assembly and electronic equipment
  • Packaging chip, circuit board assembly and electronic equipment

Examples

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Embodiment Construction

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the application with reference to the drawings in the embodiments of the application. Apparently, the described embodiments are only some of the embodiments of the application, not all of them. Based on the embodiments in this application, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the scope of protection of this application.

[0033] Reference in this application to an "embodiment" means that a particular feature, structure, or characteristic described in connection with the embodiment can be included in at least one embodiment of the present application. The occurrences of this phrase in various places in the specification are not necessarily all referring to the same embodiment, nor are separate or alternative embodiments mutually exclusive of other embodiments. It is understood explicitly and implicitl...

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Abstract

The invention provides a packaging chip, a circuit board assembly and electronic equipment. The packaging chip comprises a dielectric layer, a redistribution layer and a turn-off power line group. The dielectric layer is provided with at least one functional circuit unit and at least one power switch unit. The redistribution layer and the dielectric layer are stacked. The turn-off power line group comprises at least one first turn-off power line and at least one second turn-off power line, the first turn-off power lines are arranged on the dielectric layer, the second turn-off power lines are arranged on the redistribution layer, and the resistance of the second turn-off power lines is smaller than that of the first turn-off power lines. The first turn-off power line and the second turn-off power line are electrically connected, and both the first turn-off power line and the second turn-off power line are electrically connected between the output end of the power switch unit and the power end of the functional circuit unit. The packaging chip, the circuit board assembly and the electronic equipment provided by the invention are small in voltage drop.

Description

technical field [0001] The present application relates to the field of chip technology, in particular to a packaged chip, a circuit board assembly and electronic equipment. Background technique [0002] Chips can be used in electronic equipment in various fields such as IT, new energy, communications, robots, and home appliances. The power gating technology can be applied to the chip to improve the leakage power consumption of the chip. However, in the related art, the introduction of the power gating technology leads to an increase in the voltage drop (IR drop) of the chip, which affects the performance of the chip. Therefore, How to improve the voltage drop of the chip becomes a technical problem to be solved. Contents of the invention [0003] The present application provides a packaged chip, a circuit board assembly and an electronic device capable of improving voltage drop. [0004] In one aspect, the present application provides a packaged chip, including: [0005...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L23/528H01L23/58H05K1/18
CPCH01L23/5286H01L23/58H05K1/18
Inventor 严凡
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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