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Screen printing plate with high adhesion and manufacturing process thereof

A production process and adhesive technology, applied in printing process, printing plate preparation, screen printing, etc., can solve the problems affecting the bonding strength of the steel mesh layer 12 and the polyester mesh layer 13, etc.

Active Publication Date: 2022-03-18
JIANGSU SHENGXI ELECTRONICS SCI & TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] Screen printing is an important tool for screen printing, and it can also be said to be an important basis for screen printing. With the development of solar cells in pursuit of low cost and high efficiency, printing The screen version used during the time is getting more and more sophisticated; such as Figure 1 As shown, the existing screen structure generally includes an annular frame 11, a polyester mesh layer 13, a hot-melt film adhesive layer 14, a steel mesh layer 12, and a PI film layer 15. The layers are connected to the upper end of the annular frame body 11, and then the steel mesh layer 12 is laid in the middle of the upper end of the polyester mesh layer 13, and then the surroundings of the steel mesh layer 12 and the lower polyester mesh layer are bonded by a ring-shaped hot-melt film The layer 14 is connected by hot pressing. Generally, the hot-pressing temperature of the hot-melt film is 160 to 175°C, and then the bottom middle of the polyester mesh layer is cut to form a ring-shaped polyester mesh layer 13, and finally the PI film layer 15 is laid on the On the upper end of the steel mesh layer 12, the PI film layer 15 is hot-pressed on the steel mesh layer 12 through a hot-pressing composite process. The temperature is higher, and part of the hot-melt film adhesive layer 14 will be melted and dropped by the high temperature in the middle, which will affect the bonding strength of the steel mesh layer 12 and the polyester mesh layer 13. In addition, due to the need to weaken the high temperature of the PI film layer 15 hot pressing The impact on the hot-melt film adhesive layer 14 generally leaves a relatively large heat insulation gap 16 between the PI film layer 15 and the hot-melt film adhesive layer 14, so that the PI film layer 15 will not be laid too large On the steel mesh layer 12, the area of ​​the PI film layer 15 is limited, and the area of ​​the printed pattern of the PI film layer 15 is limited, so the present invention needs to redesign the entire manufacturing method and structure

Method used

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  • Screen printing plate with high adhesion and manufacturing process thereof
  • Screen printing plate with high adhesion and manufacturing process thereof
  • Screen printing plate with high adhesion and manufacturing process thereof

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Embodiment Construction

[0029] The content of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] like Image 6 As shown, a screen with strong adhesiveness includes an annular frame body 1, an annular connecting net 2, a screen printing mesh 3, an annular adhesive layer 5, and a polymer engraving film 4; the annular connecting net 2 includes a bottom ring Net 231, up and down accepting ring net 22, upper ring net 21; described up and down accepting ring net 22 is installed between the upper ring net 21 and the bottom ring net 231; the lower end of the described up and down accepting ring net 22 is connected to the bottom ring net 231 around outside; the upper end of the upper and lower receiving ring net 22 is connected to the surrounding inner side of the upper ring net 21; the bottom ring net 231 and the upper and lower receiving ring net 22 jointly form a sunken accommodation tank 6; The lower end of the upper ring net 21 is conn...

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PUM

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Abstract

The invention discloses a high-adhesion screen printing plate and a manufacturing process thereof. The high-adhesion screen printing plate comprises an annular frame body, an annular connecting net, silk screen gauze, an annular adhesion layer and a high-molecular carving film. According to the process disclosed by the invention, a traditional operation mode of firstly carrying out hot pressing on a hot melting film and then carrying out hot pressing on a PI film is changed, and the process disclosed by the invention is an operation mode of firstly carrying out hot pressing on the PI film and then carrying out hot pressing on the hot melting film; then the macromolecular carving film and the silk-screen mesh are placed on the connecting net made of polyester after being subjected to hot pressing, and then the connecting net and the silk-screen mesh are subjected to hot pressing through the annular bonding layer made of the hot-melt film material, so that the annular bonding layer made of the hot-melt film material subjected to hot pressing cannot be melted and drop by high temperature; and the area of the high-molecular carving film made of the PI film material, which is hot-pressed at the upper end of the silk-screen gauze, is larger.

Description

technical field [0001] The invention relates to a screen plate with strong adhesiveness and a manufacturing process thereof. Background technique [0002] Screen printing is an important tool for screen printing, and it can also be said to be an important basis for screen printing. With the development of solar cells in pursuit of low cost and high efficiency, the screen used in printing is becoming more and more sophisticated; figure 1 As shown, the existing screen structure generally includes an annular frame 11, a polyester mesh layer 13, a hot-melt film adhesive layer 14, a steel mesh layer 12, and a PI film layer 15. The layers are connected to the upper end of the annular frame body 11, and then the steel mesh layer 12 is laid in the middle of the upper end of the polyester mesh layer 13, and then the surroundings of the steel mesh layer 12 and the lower polyester mesh layer are bonded by a ring-shaped hot-melt film The layer 14 is connected by hot pressing. Generally...

Claims

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Application Information

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IPC IPC(8): B41F15/36B41F15/34B41C1/14
CPCB41F15/36B41F15/34B41C1/14B41C1/145B41P2215/12
Inventor 潘国虎
Owner JIANGSU SHENGXI ELECTRONICS SCI & TECH
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