Process for improving wire cutting roughness

Abstract

The invention discloses a technology for improving the wire cutting roughness. The technology comprises the steps that firstly, a workpiece is fixed to a workbench of a wire cutting machine; secondly, the cutting surface of the workpiece is coated with grinding liquid; thirdly, rough machining is conducted on the workpiece through a cutting machine, and rough machining of the through hole is completed; and fourthly, the cutting machine conducts finish machining on the workpiece, and finish machining of the through hole is completed. In this way, a machined workpiece does not need to be polished, and the smoothness of the workpiece is improved.

Description

technical field [0001] The invention relates to an improvement of wire-cutting roughness, in particular to a process for improving the wire-cutting roughness which can eliminate the need for polishing of processed workpieces and improve the smoothness of workpieces. Background technique [0002] Wirecut Electrical Discharge Machining (WEDM for short), sometimes also known as wire cutting. Its basic working principle is to use a continuously moving thin metal wire (called electrode wire) as an electrode to perform pulse spark discharge on the workpiece to remove metal and cut into shape; medium-feeding wire cutting reduces material deformation and molybdenum wire loss through multiple cutting The resulting error makes the processing quality relatively improved, and the processing quality can be between the high-speed wire-feeding machine and the low-speed wire-feeding machine; however, a large part of the workpieces processed by wire cutting have complex cavities and are extr...