Focusing ring and substrate processing apparatus including same

Abstract

The invention discloses a focus ring and a substrate processing apparatus including the same. The substrate processing apparatus may include: a processing module including at least one engineering chamber to perform a desired process on a substrate; and an indexing module for transferring the substrate from the outside to the inside of the processing module. The at least one engineering chamber may include: a housing internally providing an engineering space; a support unit disposed in the housing to support a substrate, the support unit including a focus ring including a plurality of rings; the gas supply unit is used for supplying engineering gas into the engineering space; and a plasma generation unit that generates plasma from the engineering gas in the engineering space. The focus ring may have a stepped structure including a plurality of stepped portions disposed downward toward the substrate. According to the invention, the service life of the focusing ring can be greatly prolonged, and the service life of the engineering chamber comprising the focusing ring and the service life of the substrate processing device comprising the focusing ring can be greatly prolonged respectively.

Description

[0001] This application enjoys the No. 1 Korean Patent Application filed with the Korean Patent Office on December 23, 2020 [0002] Priority of 10-2020-0181873. technical field [0003] Exemplary embodiments of the present invention relate to a focus ring and a substrate processing apparatus including the focus ring. More specifically, exemplary embodiments of the present invention relate to a focus ring including a stepped structure and a substrate processing apparatus having such a focus ring. Background technique [0004] The integrated circuit device or the display device can be fabricated using a substrate processing device that generally includes a deposition chamber, a sputtering chamber, an etching chamber, a cleaning chamber, a drying chamber, and other engineering chambers. Elements contained in such engineering chambers can be damaged during various processes within the engineering chamber. In particular, when the plasma etching process is performed on the subs...

AI Technical Summary

Problems solved by technology

For example, existing focus rings that include an inner ring composed of silicon carbide and an outer ring composed of silicon oxide may be susceptible to damage from plasma generated by an etching gas containing fluorine, which damage can lead to a reduction in the lifetime of the focus ring.

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