Method for on-line identifying small packaged hot connecting and disconnecting module
Patent Information
- Authority / Receiving Office
- CN Β· China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- HUAWEI TECH CO LTD
- Publication Date
- 2007-01-03
- Estimated Expiration
- Not applicable Β· inactive patent
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Abstract
Description
technical field
[0001] The invention relates to an interface module identification technology, in particular to a method for online identification of small-package hot-swappable (SFP) electrical modules. Background technique
[0002] In the field of high-speed optical interface and electrical interface transmission, SFP modules have been widely used as optical / electrical transceiver modules. SFP modules have the advantages of small size and support for hot swapping, including SFP electrical modules and SFP optical modules. Generally, the SFP module and the control unit are plugged into the same board, and the control unit controls the sending and receiving of the SFP module.
[0003] The SFP module provides a custom pin, the MOD-DEF0 pin, which is generally used to output the presence signal. The MOD-DEF0 pin is grounded inside the module, and a pull-up resistor, such as a 10K pull-up resistor, is connected outside the module. After the SFP module is inserted into a board,...