Stage device and plasma treatment apparatus

Inactive Publication Date: 2010-08-26
SHARP KK +1
View PDF11 Cites 16 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

[0015]The present invention has been attained in view of the above problems, and an object of the present invention is to provide a stage device which does not cause difference in level between the upper end of a pin in the lift pin mechanism and the setting surface in a state where a substrate is set on the setting surface of a stage, and a plasma treatment apparatus which includes such a stage device and thereby suppresses the occurrence of uneven treatment.
[0018]According to the arrangement of the stage device of the present invention, the contact adjusting means included in the lift pin mechanism brings the upper end of the first pin being withdrawn in the stage into contact with the substrate set on the setting surface without lifting the substrate above the setting surface (corresponding to adsorption surface). This makes it possible to make the upper end of the first pin positioned at the same level as the setting surface through the use of the substrate.
[0021]This arrangement is free from a gap caused by difference in level between the above-described lift pin (first pin) and the setting surface, i.e. a gap between the substrate and lift pin (first pin) or a gap between the substrate and the setting surface, where no plasma is generated and a great voltage drop occurs. This makes it possible to reduce the occurrence of uneven treatment and incomplete treatment on the substrate.
[0023]A display panel substrate of the present invention is a display panel substrate for use in manufacturing a display panel, and the display panel substrate is subjected to surface treatment by means of the above plasma treatment apparatus of the present invention capable of effectively reducing the occurrence of uneven treatment. By manufacturing a display panel including such a display panel substrate, it is possible to provide a display device having an excellent display quality without display irregularity.

Problems solved by technology

This is because mechanical precision of the lift pin mechanism 120 is limited.

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Stage device and plasma treatment apparatus
  • Stage device and plasma treatment apparatus
  • Stage device and plasma treatment apparatus

Examples

Experimental program
Comparison scheme
Effect test

first embodiment

of the Present Invention

[0063]FIGS. 1 through 11 illustrate First Embodiment of the present invention. As illustrated in a cross-sectional view of FIG. 1, a plasma treatment apparatus S of the present embodiment is arranged such that an electrode stage device (stage device) 35 and a counter electrode 3 are provided in a chamber 1. A substrate 4 to be treated (hereinafter simply referred to as “substrate 4”), such as a glass substrate, held on an electrode stage 2 of the electrode stage device 35 is subjected to plasma treatment at near atmospheric pressure.

[0064]The counter electrode 3 is realized by an electrically conductive member and is disposed so as to face the electrode stage 2. To the counter electrode 3, a power source section 10 is connected, and electrical discharge can occur between the counter electrode 3 and the electrode stage 2. The counter electrode 3 is located inside the chamber 1 at an upper position thereof, and the counter electrode 3 is connected to the gas in...

second embodiment

[0120]FIGS. 17 through 20 illustrate Second Embodiment of the present invention. In the following descriptions of embodiments, for convenience of explanation, members having the same functions as those described in First Embodiment are given the same reference numerals and explanations thereof are omitted here.

[0121]The apparatus in Second Embodiment is different from that in First Embodiment illustrated in FIG. 2 in that a plurality of adsorption holes 6a, which makes up an adsorption mechanism 6 formed in the setting surface 11 of the electrode stage 2 in the plasma treatment apparatus S, are arranged as illustrated in FIG. 17.

[0122]That is, the arrangement in which the adsorption holes 6a are arranged evenly beneath the setting surface 11 of the electrode stage 2, as illustrated in FIG. 19, may cause the problem as illustrated in FIG. 20, depending upon the magnitude of spring force exerted by the coil spring 23 of the spring type lift pin 20. That is, the substrate 4 cannot be a...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
Forceaaaaaaaaaa
Pressureaaaaaaaaaa
Elasticityaaaaaaaaaa
Login to View More

Abstract

The present invention provides a stage device which does not generate the difference in level between an upper end of a lift pin and a setting surface of a stage in a state where a substrate to be treated is set on the setting surface of the stage, and provides a plasma treatment apparatus which suppresses the occurrence of uneven treatment by using the stage device as an electrode stage. At the center of an electrode stage (2), a spring type lift pin (20) having elasticity in a direction where the pin moves is provided. When the spring type lift pin (20) is at a storage position, a pin upper end (20a) of the spring type lift pin (20) protrudes above the setting surface (11) of the electrode stage (2). When the substrate (4) to be treated is set and adsorbed on the setting surface (11), the upper end of the lift pin is pressed down to the position that is at the same level as that of the setting surface (11) by a load applied by the substrate (4).

Description

TECHNICAL FIELD[0001]The present invention relates to a plasma treatment apparatus which performs plasma treatment at near atmospheric pressure, and a stage device which can be suitably used in a treatment apparatus, such as the plasma treatment apparatus, and allows a substrate to be treated to be set thereon.BACKGROUND ART[0002]Conventionally, surface treatment of a substrate made from, for example, glass, plastic, or other material by means of glow discharge plasma at a low pressure ranging from appropriately 0.1 Torr to 10 Torr is widely known and industrially applied. Surface treatment at such a vacuum-level low pressure prevents a shift from discharge to arc discharge, and therefore can be performed even on the substrate made from plastic or other material having a high heat resistance.[0003]However, surface treatment by low-pressure glow discharge plasma requires an expensive vacuum chamber as a treatment container, and an evacuation unit. In addition, upsizing of substrates,...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
IPC IPC(8): C23F1/08
CPCB65G49/064B65G49/065B65G2249/02B65G2249/04H01L21/68778H01J37/32431H01J2237/20H01L21/68742B65G2249/045
InventorWAKASAKI, TAMAKISATOH, TAKASHITANAKA, KEIICHINAKAJIMA, SETSUOMAYUMI, SATOSHINAKANO, YOSHINORI
OwnerSHARP KK