Resin for thermal imprint
a technology of resin and imprint, applied in the direction of printed circuit aspects, printed circuit manufacturing, manufacturing tools, etc., can solve the problems of low heat resistance, size distortion, and advanced and complex processing techniques, and achieve the effect of improving imprint characteristics, reducing manufacturing costs, and improving productivity (throughput)
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example 1
Evaluation for Imprinting on Injection Molded Body
[0068]Sample 1 was fixed on a plate which was heated to a glass transition temperature Tg−18° C. (i.e., 117° C.), a mold (pattern: line / space (L / S)=1 μm / 1 μm) which was preheated to a molding set temperature Tg+25° C. (i.e., 160° C.) was pressed against the surface of the resin substrate at a speed of 100 μm / second, and when the load sensor attached to the upper part of the mold reached 1000 N, it was held for 10 seconds by that load. Thereafter, it was cooled to Tg−18° C. (117° C.) while maintaining the displacement of the mold, and after the completion of cooling, the mold was released from the substrate at a speed of 10 μm / second. It was observed through an electronic microscope that a good pattern was transferred. The observation result is shown in table 1.
example 2
Evaluation for Imprinting on Injection Molded Body)
[0069]Sample 1 was fixed on a plate which was heated to a glass transition temperature Tg−18° C. (i.e., 117° C.), a mold (pattern: L / S=1 μm / 1 μm) which was preheated to a molding set temperature Tg+25° C. (i.e., 160° C.) was pressed against the surface of the resin substrate at a speed of 100 μm / second, and when the load sensor attached to the upper part of the mold reached 750 N, it was held for 10 seconds by that load. Thereafter, it was cooled to Tg−18° C. (117° C.) while maintaining the displacement of the mold, and after the completion of cooling, the mold was released from the substrate at a speed of 10 μm / second. It was observed through an electronic microscope that a good pattern was transferred. The observation result is shown in table 1.
example 3
Evaluation for Imprinting on Injection Molded Body
[0070]Sample 1 was fixed on a plate which was heated to a glass transition temperature Tg−18° C. (i.e., 117° C.), a mold (pattern: L / S=1 μm / 1 μm) which was preheated to a molding set temperature Tg+35° C. (i.e., 170° C.) was pressed against the surface of the resin substrate at a speed of 100 μm / second, and when the load sensor attached to the upper part of the mold reached 350 N, it was held for 10 seconds by that load. Thereafter, it was cooled to Tg−18° C. (117° C.) while maintaining the displacement of the mold, and after the completion of cooling, the mold was released from the substrate at a speed of 10 μm / second. It was observed through an electronic microscope that a good pattern was transferred. The observation result is shown in table 1 and table 3.
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