Flow distributor for heat transfer plate

Inactive Publication Date: 2016-01-28
HAMILTON SUNDSTRAND SPACE SYST INT
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Benefits of technology

This patent describes a device that helps distribute fluid evenly in a heat transfer system. The device includes a sheath with holes and an insert with channels. Each channel is connected to one of the sheath's holes. The device inlet has two openings: an inner and an outer. The device helps mix the fluid flow evenly in the inlet so that it is evenly distributed into the channels and the heat transfer device. This improves the efficiency of the heat transfer system.

Problems solved by technology

While circuitry continues to shrink in size, developing heat transfer devices sufficient to move heat away from the components is becoming increasingly difficult.
Due to co-existence of multiple states (e.g., liquid and gas) of the refrigerant, the fluid enters into the different layers unevenly, causing uneven thermal distribution and thermal acceptance of each layer.
This has presented a limitation on heat transfer that has traditionally had to be taken into account in designing for satisfactory thermal performance.

Method used

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  • Flow distributor for heat transfer plate
  • Flow distributor for heat transfer plate
  • Flow distributor for heat transfer plate

Examples

Experimental program
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Embodiment Construction

[0026]Reference will now be made to the drawings wherein like reference numerals identify similar structural features or aspects of the subject disclosure. For purposes of explanation and illustration, and not limitation, a perspective view of an embodiment of the flow distributor in accordance with the disclosure is shown in FIGS. 1A and 1B and is designated generally by reference character 100. Other views of the flow distributor of FIGS. 1A and 1B, and aspects thereof, are shown in FIGS. 2-9. The systems and methods described herein can be used to evenly distribute multiphase fluid flow to a heat transfer device having multiple channels.

[0027]Referring generally to FIGS. 1A, 1B, and 2, a flow distributor 100 for a heat transfer device (e.g., device 201 shown in FIG. 2) includes a sheath 101 defining a plurality of distributor holes 107. As shown in FIG. 2, each distributor hole 107 is configured to be in fluid communication with a respective channel inlet 204 of each channel 205 ...

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Abstract

A flow distributor for a heat transfer device having a plurality of channels includes a sheath defining a plurality of distributor holes, each distributor hole configured to be in fluid communication with a respective channel inlet of each channel of the heat transfer device and an insert defining a plurality of fluid channels therein and a fluid inlet, each fluid channel in fluid communication with the fluid inlet. The insert is disposed within the sheath to seal the fluid channels with each fluid channel in fluid communication with a respective one of the distribution holes. The fluid inlet includes an inner inlet and an outer inlet radially outward from the inner inlet for mixing a fluid flow in the fluid inlet for evenly distributing fluid flow (e.g., a two phase flow) into the fluid channels of the insert and into each channel of the heat transfer device.

Description

BACKGROUND[0001]1. Field[0002]The present disclosure relates to heat transfer systems, and more particularly to heat transferring structures and plates.[0003]2. Description of Related Art[0004]Electrical components in circuitry (e.g., aircraft or spacecraft circuits) require sufficient heat transfer away from the components and / or the system in order to continue to function. Many mechanisms have been used to accomplish such a task, e.g., fans, heat transfer plates, actively cooled devices such as tubes or plates including tubes therein for passing coolant over a hot surface. While circuitry continues to shrink in size, developing heat transfer devices sufficient to move heat away from the components is becoming increasingly difficult.[0005]Certain heat transfer devices include multiple layers of passages for refrigerant to pass therethrough, all connected to a single inlet. Due to co-existence of multiple states (e.g., liquid and gas) of the refrigerant, the fluid enters into the di...

Claims

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Application Information

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IPC IPC(8): F28D15/02
CPCF28D15/02F25B39/028F28F9/0273F28F9/0278F28D9/005
InventorO' COIN, JAMES R.ZAFFETTI, MARK A.BANACH, THOMAS E.COOKE, DALE T.STRANGE, JEREMY M.
OwnerHAMILTON SUNDSTRAND SPACE SYST INT