Die bonder and bonding method

Abstract

With a die bonder or a bonding method, the die is adsorbed by the collet, the dicing tape to which the die is adsorbed is thrust up, the die adsorbed by the collet, and thrust up is peeled from the dicing tape, and the peeled die is bonded to the substrate. When the decrease in the air leak flow rate through the gap between the collet and the die upon the thrust up is smaller than the decrease in the normal peel by a predetermined amount, it is judged that a deflection occurs in the die.

Description

BACKGROUND OF THE INVENTION[0001]The present invention relates to a die bonder and a bonding method, and more particularly, to a die bonder and a bonding method which are highly reliable.RELATED ART[0002]A process of assembling a package by mounting a die (semiconductor chip)(hereinafter simply referred to as a die) onto a substrate such as a wiring substrate and a lead frame includes a step of separating a die from a semiconductor wafer (hereinafter simply referred to as a wafer), and a die bonding step of bonding the separated dies onto the substrate.[0003]The bonding step includes a peeling step that peels the dies separated from the wafer. In the peeling step, each die is peeled from a dicing tape held by a pickup device one by one, and is further conveyed onto the substrate using a suction jig called collet.[0004]JP-A No. 2002-184836 and JP-A No. 2007-42996 disclose the peeling step as generally employed technique. JP-A No. 2002-184836 discloses that a group of first thrust-up ...

AI Technical Summary

Benefits of technology

The patent text focuses on reducing the thickness of semiconductor device packages to promote high-density packaging. A specific type of package, called a stacked package, which allows multiple dies to be mounted on a memory card has been developed. To achieve this, the invention provides a highly reliable die bonder that can detect any deflection in the die, even if there are no cracks present. The invention also provides a method for bonding dies using this new technique. Overall, the invention allows for better control and reliability during the packaging process.

Problems solved by technology

As the thickness of the die is reduced, rigidity of the die is significantly deteriorated compared to the adhesive power of the dicing tape.

This may cause the risk of increasing the possibility to cause the crack in the die to be higher than the generally employed case.

However, the generally employed technique is not capable of judging occurrence of deflection if no crack occurs.

Especially, even a large deflection amount which may cause the non-conforming product cannot be detected.

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