SSOP21 fully-integrated intelligent power module

Abstract

The invention discloses an SSOP21 fully-integrated intelligent power module which comprises a metal copper frame, a motor control IC chip, a driving IC chip, a power chip and a plastic package body, the motor control IC chip, the driving IC chip and the power chip are all arranged on the metal copper frame, and the plastic package body packages the metal copper frame, the motor control IC chip, the driving IC chip and the power chip. The power chip comprises three NMOS (N-channel Metal Oxide Semiconductor) transistors and three PMOS (P-channel Metal Oxide Semiconductor) transistors, namely a first NMOS transistor, a second NMOS transistor and a third NMOS transistor, and a first PMOS transistor, a second PMOS transistor and a third PMOS transistor, compared with a low-voltage one chip scheme, the low-voltage fully-integrated intelligent power module disclosed by the invention has the obvious advantages that the difficulty of a chip production and manufacturing process is reduced, the process maturity is high, the cost is low, the power density is large, the power consumption is low, and the cost is low. The circuit has the characteristics of high reliability, low cost, high power density, compact circuit structure, small module size and the like.

Description

Technical Field

[0001] The invention relates to the technical field of power electronics, in particular to an SSOP21 fully integrated intelligent power module. Background Art

[0002] Intelligent power module (IPM) is a module product that integrates drive and power. One type of module integrates control, drive and power, which is also a type of intelligent power module. Currently, the intelligent power modules on the market are mainly high-voltage, and low-voltage intelligent power modules are relatively rare. There are two mainstream solutions for low-voltage fully integrated intelligent power modules, namely one chip solution and package solution. The one chip solution is to make the control, drive and power into a chip, package it, and connect the metal wires between the chip and the pins. The difference between the package solution and the one chip is that the control, drive and power are separated into three types of chips, and the module is made according to the circuit structure through packaging and metal wires connecting the pins.

[0003] With the improvement of modern living standards, most daily necessities of motor-driven products have begun to pursue the trend of miniaturization and high power density.

[0004] Traditional single-tube solutions and products cannot be well matched, PCB layout is difficult, or the wiring is too long, resulting in poor signal and other problems. For example, in water pump and floor fan applications, the current mainstream solution providers use separate module products, which require a large PCB frame. Summary of the invention

[0005] The purpose of this section is to summarize some aspects of the embodiments of the present invention and briefly introduce some preferred embodiments. Some simplifications or omissions may be made in this section and the specification abstract and the invention title of this application to avoid blurring the purpose of this section, the specification abstract and the invention title, and such simplifications or omissions cannot be used to limit the scope of the present invention.

[0006] Therefore, the object of the present invention is to provide a SSOP21 fully integrated intelligent power module, which has the characteristics of high reliability, low cost, high power density, compact circuit structure, small module size, etc.

[0007] To solve the above technical problems, according to one aspect of the present invention, the present invention provides the following technical solutions:

[0008] A SSOP21 fully integrated intelligent power module, comprising: a metal copper frame, a motor control IC chip, a driver IC chip, a power chip and a plastic package;

[0009] The motor control IC chip, the driver IC chip and the power chip are all arranged on the metal copper frame;

[0010] The plastic package encapsulates the metal copper frame, the motor control IC chip, the driver IC chip and the power chip.

[0011] As a preferred solution of the SSOP21 fully integrated intelligent power module described in the present invention, the motor control IC chip is an MCU or an ASIC.

[0012] As a preferred solution of the SSOP21 fully integrated intelligent power module described in the present invention, the power chip includes 3 NMOS tubes and 3 PMOS tubes, namely the first NMOS tube, the second NMOS tube, the third NMOS tube and the first PMOS tube, the second PMOS tube, and the third PMOS tube.

[0013] As a preferred solution of the SSOP21 fully integrated intelligent power module described in the present invention, the metal copper frame extends to both sides of the plastic package to form pins 1-21;

[0014] The drain of the first NMOS tube is connected to the 6th pin through a metal wire, and the source is connected to the 7th pin through a metal wire. The drain of the second NMOS tube is connected to the 9th pin through a metal wire, and the source is connected to the 8th pin through a metal wire. The drain of the third NMOS tube is connected to the 21st pin through a metal wire, and the source of the third NMOS tube is connected to the 20th pin through a metal wire. The gates of the first NMOS tube, the second NMOS tube, and the third NMOS tube are connected to NO1-NO3 of the driver IC chip through metal wires.

[0015] The drain of the first PMOS tube is connected to the 6th pin through a metal wire, and the source is connected to the 5th pin through a metal wire. The drain of the second PMOS tube is connected to the 9th pin through a metal wire, and the source is connected to the 5th pin through a metal wire. The drain of the third PMOS tube is connected to the 21st pin through a metal wire, and the source is connected to the 5th pin through a metal wire. The gates of the first PMOS tube, the second PMOS tube, and the third PMOS tube are connected to PO1-PO3 of the driver IC chip through metal wires.

[0016] As a preferred solution of the SSOP21 fully integrated intelligent power module described in the present invention, the PA3-PA5 pins of the motor control IC chip are connected to the 13-15 pins through metal wires, the PA6, PA7, and PB0 pins of the motor control IC chip are connected to the 11, 12, and 17 pins through metal wires, and the PB2, PA8, PA13, and PA14 pins of the motor control IC chip are connected to the 10, 1, 2, and 3 pins through metal wires.

[0017] As a preferred solution of the SSOP21 fully integrated intelligent power module described in the present invention, the PVCC pin of the driver IC chip is connected to the 5th pin through a metal wire, the AVCC pin of the driver IC chip is connected to the 4th pin through a metal wire, the LIN1-LIN3 and HIN1-HIN3 pins of the driver IC chip are connected to the pins PB3-PB8 of the motor control IC chip through metal wires, the LDO output pin of the driver IC chip is connected to the VDDIO1 pin port of the motor control IC chip through a metal wire, and the VDDIO2 pin port is connected to the 16th pin through a metal wire.

[0018] As a preferred solution of the SSOP21 fully integrated intelligent power module described in the present invention, the metal copper frame is divided into a first base island, a second base island, a third base island and a fourth base island, and the first base island, the second base island, the third base island and the fourth base island are separated and insulated from each other;

[0019] The first base island is provided with a motor control IC chip and a driver IC chip;

[0020] The second base island is provided with a first NMOS tube and a first PMOS tube;

[0021] The third base island is used to place the second NMOS transistor and the second PMOS transistor;

[0022] The third NMOS tube and the third PMOS tube are placed on the fourth base island.

[0023] Compared with the prior art, the present invention has the following beneficial effects: the low-voltage fully integrated intelligent power module of the present invention has obvious advantages over the low-voltage one chip solution, and the specific advantages are: the chip production and manufacturing process is less difficult, the process maturity is high, the cost is low, the power density is high, and it has the characteristics of high reliability, low cost, high power density, compact circuit structure, and small module size. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] In order to more clearly illustrate the technical solutions of the embodiments of the present invention, the present invention will be described in detail below in combination with the accompanying drawings and detailed embodiments. Obviously, the drawings described below are only some embodiments of the present invention. For ordinary technicians in this field, other drawings can be obtained based on these drawings without creative labor. Among them:

[0025] Figure 1 This is a schematic diagram of the overall structure of a SSOP21 fully integrated intelligent power module of the present invention;

[0026] Figure 2 A schematic diagram of the circuit structure of a SSOP21 fully integrated intelligent power module of the present invention;

[0027] Figure 3 This is a schematic structural diagram of a metal copper frame of a SSOP21 fully integrated intelligent power module of the present invention;

[0028] Figure 4 The present invention is a schematic diagram of the installation structure of a metal copper frame, a motor control IC chip, a driver IC chip and a power chip of a SSOP21 fully integrated intelligent power module. DETAILED DESCRIPTION

[0029] In order to make the above-mentioned objects, features and advantages of the present invention more obvious and easy to understand, the specific embodiments of the present invention are described in detail below with reference to the accompanying drawings.

[0030] Secondly, the present invention is described in detail with reference to schematic diagrams. When describing the embodiments of the present invention in detail, for the sake of convenience, the cross-sectional diagrams showing the device structure will not be partially enlarged according to the general scale, and the schematic diagrams are only examples, which should not limit the scope of protection of the present invention. In addition, in actual production, the three-dimensional dimensions of length, width and depth should be included.

[0031] In order to make the objectives, technical solutions and advantages of the present invention more clear, the embodiments of the present invention will be further described in detail below with reference to the accompanying drawings.

[0032] The invention provides an SSOP21 fully integrated intelligent power module, which has the characteristics of high reliability, low cost, high power density, compact circuit structure, small module volume, etc.

[0033] Figure 1-Figure 4 The structural diagram of an embodiment of a SSOP21 fully integrated intelligent power module of the present invention is shown in FIG. Figure 1-Figure 4 The present embodiment is a SSOP21 fully integrated intelligent power module, the main body of which includes a metal copper frame 100, a motor control IC chip 200, a driver IC chip 300, a power chip 400 and a plastic package 500.

[0034] The motor control IC chip 200 , the driver IC chip 300 and the power chip 400 are all arranged on the metal copper frame 100 ;

[0035] The plastic package 500 encapsulates the metal copper frame 100 , the motor control IC chip 200 , the driver IC chip 300 and the power chip 400 .

[0036] This embodiment is introduced with 1 motor control chip 200 + 1 low-voltage 3-phase PN driver, that is, driver IC chip 300 + 6 low-voltage power MOSFETs, that is, power chip 400, that is, 1 motor control IC + 1 low-voltage 3-phase PN driver + 6 power MOSFETs are sealed in a package as a whole, which is a low-voltage fully integrated intelligent power module.

[0037] It should be understood that the six power MOSFET circuits, ie, the power chip 400 includes three NMOS tubes and three PMOS tubes.

[0038] It should be understood that the low-voltage 3-phase PN drive can add different functions on the basis of satisfying the basic driving function, such as VTS function, LDO function, etc., and corresponding functions can be added according to different applications.

[0039] It should be understood that the motor control IC chip 200 controls the motor drive and needs to have OP function, AD function, serial port function, etc. The motor control IC chip 200 can be an MCU or an ASIC, and is not limited to the type of motor control IC.

[0040] See also Figure 2 and Figure 3 , 3 NMOS tubes and 3 PMOS tubes, namely the first NMOS tube 410, the second NMOS tube 420, the third NMOS tube 430 and the first PMOS tube 440, the second PMOS tube 450, and the third PMOS tube 460. The metal copper frame 100 extends to both sides of the plastic package 500 to form pins 1-21.

[0041] The drain of the first NMOS tube 410 is connected to the 6th pin through a metal wire, and the source is connected to the 7th pin through a metal wire. The drain of the second NMOS tube 420 is connected to the 9th pin through a metal wire, and the source is connected to the 8th pin through a metal wire. The drain of the third NMOS tube 430 is connected to the 21st pin through a metal wire, and the source of the third NMOS tube 430 is connected to the 20th pin through a metal wire. The gates of the first NMOS tube 410, the second NMOS tube 420, and the third NMOS tube 430 are connected to NO1-NO3 of the driver IC chip 300 through metal wires.

[0042] The drain of the first PMOS tube 440 is connected to the 6th pin through a metal wire, and the source is connected to the 5th pin through a metal wire. The drain of the second PMOS tube 450 is connected to the 9th pin through a metal wire, and the source is connected to the 5th pin through a metal wire. The drain of the third PMOS tube 460 is connected to the 21st pin through a metal wire, and the source is connected to the 5th pin through a metal wire. The gates of the first PMOS tube 440, the second PMOS tube 450, and the third PMOS tube 460 are connected to PO1-PO3 of the driver IC chip 300 through metal wires.

[0043] The PA3-PA5 pins of the motor control IC chip 200 are connected to the 13-15 pins through metal wires, the PA6, PA7, and PB0 pins of the motor control IC chip 200 are connected to the 11, 12, and 17 pins through metal wires, and the PB2, PA8, PA13, and PA14 pins of the motor control IC chip 200 are connected to the 10, 1, 2, and 3 pins through metal wires.

[0044] The PVCC pin of the driver IC chip 300 is connected to the 5th pin through a metal wire, the AVCC pin of the driver IC chip 300 is connected to the 4th pin through a metal wire, the LIN1-LIN3 and HIN1-HIN3 pins of the driver IC chip 300 are connected to the pins PB3-PB8 of the motor control IC chip 200 through metal wires, the LDO output pin of the driver IC chip 300 is connected to the VDDIO1 pin of the motor control IC chip 200 through a metal wire, and the VDDIO2 pin is connected to the 16th pin through a metal wire.

[0045] In addition, the metal copper frame 100 is divided into a first base island 110, a second base island 120, a third base island 130 and a fourth base island 140, and the first base island 110, the second base island 120, the third base island 130 and the fourth base island 140 are separated and insulated from each other. The motor control IC chip 200 and the driver IC chip 300 are arranged on the first base island 110, the first NMOS tube 410 and the first PMOS tube 440 are placed on the second base island 120, the second NMOS tube 420 and the second PMOS tube 450 are placed on the third base island 130, and the third NMOS tube 430 and the third PMOS tube 460 are placed on the fourth base island 140.

[0046] Although the present invention has been described above with reference to the embodiments, various modifications may be made thereto and parts thereof may be replaced by equivalents without departing from the scope of the present invention. In particular, as long as there is no structural conflict, the various features in the embodiments disclosed in the present invention may be used in combination with each other in any manner, and the fact that these combinations are not exhaustively described in this specification is only for the sake of omitting space and saving resources. Therefore, the present invention is not limited to the specific embodiments disclosed herein, but includes all technical solutions falling within the scope of the claims.

Claims

1. A SSOP21 fully integrated intelligent power module, characterized in that: include: A metal copper frame (100), a motor control IC chip (200), a driver IC chip (300), a power chip (400) and a plastic package (500); The motor control IC chip (200), the driver IC chip (300) and the power chip (400) are all arranged on the metal copper frame (100); The plastic package (500) encapsulates the metal copper frame (100), the motor control IC chip (200), the driver IC chip (300) and the power chip (400).

2. The SSOP21 fully integrated intelligent power module according to claim 1, characterized in that: The motor control IC chip (200) is an MCU or an ASIC.

3. The SSOP21 fully integrated intelligent power module according to claim 1, characterized in that: The power chip (400) comprises three NMOS tubes and three PMOS tubes, namely a first NMOS tube (410), a second NMOS tube (420), a third NMOS tube (430) and a first PMOS tube (440), a second PMOS tube (450), and a third PMOS tube (460).

4. The SSOP21 fully integrated intelligent power module according to claim 3, characterized in that: The metal copper frame (100) extends to both sides of the plastic package body (500) to form pins 1 to 21; The drain of the first NMOS tube (410) is connected to the sixth pin via a metal wire, and the source is connected to the seventh pin via a metal wire; the drain of the second NMOS tube (420) is connected to the ninth pin via a metal wire, and the source is connected to the eighth pin via a metal wire; the drain of the third NMOS tube (430) is connected to the twenty-first pin via a metal wire, and the source of the third NMOS tube (430) is connected to the twentyth pin via a metal wire; and the gate electrodes of the first NMOS tube (410), the second NMOS tube (420), and the third NMOS tube (430) are connected to NO1-NO3 of the driver IC chip (300) via metal wires; The drain of the first PMOS tube (440) is connected to the sixth pin through a metal wire, and the source is connected to the fifth pin through a metal wire; the drain of the second PMOS tube (450) is connected to the ninth pin through a metal wire, and the source is connected to the fifth pin through a metal wire; the drain of the third PMOS tube (460) is connected to the twenty-first pin through a metal wire, and the source is connected to the fifth pin through a metal wire; the gate electrodes of the first PMOS tube (440), the second PMOS tube (450), and the third PMOS tube (460) are connected to PO1-PO3 of the driving IC chip (300) through metal wires.

5. The SSOP21 fully integrated intelligent power module according to claim 4, characterized in that: The PA3-PA5 pins of the motor control IC chip (200) are connected to the 13-15 pins via metal wires, the PA6, PA7, and PB0 pins of the motor control IC chip (200) are connected to the 11, 12, and 17 pins via metal wires, and the PB2, PA8, PA13, and PA14 pins of the motor control IC chip (200) are connected to the 10, 1, 2, and 3 pins via metal wires.

6. The SSOP21 fully integrated intelligent power module according to claim 4, characterized in that: The PVCC pin of the driver IC chip (300) is connected to the 5th pin via a metal wire, the AVCC pin of the driver IC chip (300) is connected to the 4th pin via a metal wire, the LIN1-LIN3 and HIN1-HIN3 pins of the driver IC chip (300) are connected to the pins PB3-PB8 of the motor control IC chip (200) via metal wires, the LDO output pin of the driver IC chip (300) is connected to the VDDIO1 pin port of the motor control IC chip (200) via a metal wire, and the VDDIO2 pin port is connected to the 16th pin via a metal wire.

7. The SSOP21 fully integrated intelligent power module according to claim 3, characterized in that: The metal copper frame (100) is divided into a first base island (110), a second base island (120), a third base island (130) and a fourth base island (140), and the first base island (110), the second base island (120), the third base island (130) and the fourth base island (140) are separated and insulated from each other; A motor control IC chip (200) and a driver IC chip (300) are arranged on the first base island (110); The second base island (120) is provided with a first NMOS transistor (410) and a first PMOS transistor (440); The third base island (130) is used to place a second NMOS transistor (420) and a second PMOS transistor (450); The fourth base island (140) is provided with a third NMOS transistor (430) and a third PMOS transistor (460).

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