The invention relates to a
ceramic matrix composite micro-
deep hole multi-frequency pulsating
chip removal enhanced
machining method and
system. According to the method, axial and radial
ultrasonic vibration and axial low-frequency pulsation are simultaneously generated on a tool during
machining, wherein the amplitude of the low-frequency pulsation is greater than that of the axial
ultrasonic vibration. A through hole which is axially formed and allows cooling liquid to pass through is formed in the tool, when the tool moves upwards in a low-frequency pulsation mode, instantaneous low pressure is formed in a
cutting area, the cooling liquid is provided for the
cutting area through the tool, and the cooling liquid located on the outer side of the tool flows back to the
cutting area. When the tool moves downwards in a low-frequency pulsation mode, the cooling liquid is stopped from being provided for the cutting area, instantaneous
high pressure is formed in the cutting area, the cooling liquid moves towards the outside of a gap channel between the tool and a workpiece through the gap channel, meanwhile, the cooling liquid is matched with ultrasonic
radial vibration, the width of the gap channel is periodically increased, and
chip removal is promoted. According to the method, the
machining quality is greatly improved, the service life of the tool is greatly prolonged, meanwhile, efficient
chip removal is achieved, and the purpose of efficient and high-quality micro-
deep hole machining of
ceramic materials is achieved.