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Cooling-heating cup

A hot and cold, cup body technology, applied in drinking utensils, beverage preparation devices, household appliances, etc., can solve the problems that are not mentioned, and achieve the effect of extending working time, reducing accumulation, and maximizing heat transfer and heat dissipation effects.

Inactive Publication Date: 2007-11-14
NINGBO LIXIN TOUR PROD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, there is no effective measure to solve this technical problem in the existing technology.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] Embodiment 1, with reference to Fig. 1 and Fig. 2.

[0032] In this embodiment, the cup body 101 is provided with a cup cover 100 that can be opened and closed, and the outer wall of the cup body 101 is provided with a handle 105 and a control panel 103. connect.

[0033] The inner container 106 is arranged in the cup body 101 and has a receiving space for containing liquid food. The lower end 107 of the inner container protrudes downwards, and the insulation layer is arranged between the cup body 101 and the inner container 106 for heat insulation. insulation effect;

[0034] The cup holder 8 is made up of a cup lower body 81 and a guard plate 82. The guard plate 82 surrounds the outer side of the cup lower body 81 in a cylindrical shape. The guard plate 82 is provided with air outlet holes. It is a frame body with a space for accommodating the heat dissipation mechanism 5. It has an air inlet at the bottom, and a filter 7 is arranged at the air inlet. The filter 7 i...

Embodiment 2

[0044] Embodiment 2, referring to Fig. 3, the filter screen 7 in this embodiment extends upwards from the disk surface to the air outlet 821 to form a cylindrical shape, so that the design can make the air inlet and outlet process all achieve the purpose of dust-free, better protection Each component in the cup holder 8. Other structures are the same as in Embodiment 1.

Embodiment 3

[0045] Embodiment 3, referring to Fig. 4 , the top of the cup lid 100 is provided with a cup lid dial 107, and the upper temperature guide 1 is in the shape of an inverted "T" when viewed from the side, and its upper part is provided with a groove for the bottom of the inner container 106 to protect The plate 82 is provided with a plurality of circular through holes to form the air outlet 821. In this embodiment, the filter bag 7a is used as the filter dustproof device. The opening of the filter bag 7a is provided with an elastic steel wire 7b for propping up the filter bag 7a and exerting an external force. Compress the elastic steel wire 7b and place it inside the cup lower body 81. When the pocket is released, the compressed elastic steel wire 7b bounces back to its original shape, thereby pressing itself into the inner slot 811 on the upper part of the cup lower body 81 to realize its positioning. . And radiator 5 and fan 6 are located in filter bag 7a. Other structures a...

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Abstract

The present invention relates to a cold and hot cup. It is characterized by that it includes a cup body, an internal container with containing space, heat-insulating layer, cup seat with air inlet and air outlet upper temperature-conducting component close to the bottom portion of said internal container, lower temperature-conducting component, semiconductor cold and hot chip whose upper end surface is close to upper temperature-conducting component and whose lower end surface is close to lower temperature-conducting component, heat-insulating plate and radiation mechanism formed from radiator and blower fan positioned under the radiator. Besides, the air inlet of said cup seat also is equipped with a filtering dust-preventing device.

Description

technical field [0001] The invention relates to a hot and cold cup, in particular to a hot and cold cup for carrying and using outside. Background technique [0002] Semiconductor refrigeration is also called thermoelectric refrigeration or thermoelectric refrigeration. This technology is based on the working principle of the Peltier effect, that is, when the current flows through the junction formed by two different conductors, heat release and heat absorption will occur. Since the end of the 1950s, with the rapid development of semiconductor materials with better thermoelectric properties, this technology has been paid attention to, because it has no pollution, no noise, small size, long life, light weight and reliable operation. , easy maintenance, can achieve two different purposes of cooling and heating by changing the direction of the current, etc., are now applied in many military fields. [0003] Recently, this technology has gradually increased in civilian househol...

Claims

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Application Information

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IPC IPC(8): A47G19/22A47G23/04A47J31/00
Inventor 程淑娟朱开波李武
Owner NINGBO LIXIN TOUR PROD
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