Polyimide multilayered adhesive film and process for producing the same

A polyimide layer, polyimide technology, used in chemical instruments and methods, film/sheet adhesives, adhesives, etc. problem, to achieve the effect of continuous productivity and uniform film thickness and size
CN101080471AInactive Publication Date: 2007-11-28KANEKA CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
KANEKA CORP
Publication Date
2007-11-28
Estimated Expiration
Not applicable · inactive patent

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Abstract

This invention provides a polyimide multilayered adhesive film, which can accurately measure the thickness of each layer by a infrared absorption method, and a process for producing the same. The adhesive film comprises a highly heat-resistant polyimide layer, and an adhesive layer containing a thermoplastic polyimide and provided on at least one surface of the highly heat-resistant polyimide layer. The adhesive film is produced by a coextrusion-cast coating method and is characterized in that any one of the highly heat-resistant polyimide layer and the adhesive layer is composed mainly of a polyimide resin containing a functional group which exhibits a characteristic infrared absorption wavelength. Thereafter, in the step of measuring the film thickness, the film thickness of each layer is measured with an infrared light absorption-type film thickness measuring meter, and, based on the resultant film thickness measured data, the film thickness of each layer during film formation is controlled and regulated for the production of the polyimide multilayered adhesive film.
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Description

technical field

[0001] The present invention relates to a multilayer adhesive film in which an adhesive layer containing thermoplastic polyimide is provided on at least one side of a highly heat-resistant polyimide layer, and the thickness of each layer is controlled, and is used for producing the film in which each layer is controlled Thick film technology. Background technique

[0002] In recent years, with the reduction in weight, size, and density of electronic products, the demand for various printed circuit boards has increased. Among them, the demand for flexible laminates (also referred to as flexible printed wiring boards (FPC), etc.) has increased in particular. . The flexible laminate has a structure in which a circuit including a metal foil is formed on an insulating film.

[0003] The above-mentioned flexible laminate is generally formed of various insulating materials, and a flexible insulating film is used as a substrate. On the surface of the substrate, met...

Claims

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