Anode linking device

Abstract

The invention provides an anodic bonding device which essentially comprises an outer cavity, a pressure device, electrodes and a self-leveling device that is positioned at the bottom of the outer cavity; the self-leveling device is provided with a substrate which is equipped with a base plate and a lug boss positioned on the base plate; the interior of the lug boss is evenly provided with at least three counter bores which are internally provided with springs; the upper end of the spring is provided with a ball-end columella, the other end of the ball-end columella, which is in a hemispheric shape, extends out of the counter bore and is connected with the thermal insulation substrate, the periphery of the lug boss on the base plate is provided with three gag lever posts which are evenly distributed, the gag lever post is slightly higher than the contact face of the ball-end columella and the thermal insulation substrate, so as to limit thermal insulation substrate. In the invention, the self-leveling device can ensure that the whole bonding device forms an up and down floating structure, thus realizing the self-leveling during sample plate bonding and uniform attachment of sample plates.

Description

technical field [0001] The invention relates to the field of micro-electromechanical systems, in particular to an anodic bonding device. Background technique [0002] Anodic bonding is a widely used bonding process in the field of micro-electromechanical systems, mainly to achieve permanent bonding between metals and insulators. Its main feature is that two samples that are closely bonded at a certain temperature form a permanent bond under the action of an electrostatic field, and finally a new composite material is obtained. [0003] In the process of operation, the quality of bonding between the samples directly affects the bonding result and quality. If the bonding between the samples is uneven, it may lead to final bonding failure. Therefore, the design of a device that can automatically adjust can be effective. To ensure the smooth completion of bonding. In the prior art, there are some leveling devices that help the samples to fit evenly, but the structure is relati...

AI Technical Summary

Problems solved by technology

In the prior art, there are some leveling devices that help the samples to fit evenly, but the structure is relatively complicated and the effect is not significant

[0004] In addition, the existing anodic bonding technology is slightly insufficient in terms of equipment functions. In many practical cases, bonding under specific environmental conditions is required, such as vacuum environment, special atmosphere environment, and high pressure environment, etc., and in some cases The samples need to be specially treated and operated before the bonding operation. These requirements require a targeted design of the bonding equipment, and factors such as ease of operation, reliability and efficiency must be taken into account.

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