Coplanarity detector for pins of IC chip
A coplanarity, detector technology, applied in instruments, measuring devices, optical devices, etc., can solve the problems of complex objective lens structure, high processing cost, slow detection speed, etc. Small area effect
Inactive Publication Date: 2009-05-06
GUILIN UNIV OF ELECTRONIC TECH
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Problems solved by technology
[0003] 1. The detection speed is slow. Because it is necessary to control the depth of field of the objective lens to 0.1mm, the field of view of the objective lens should not be too large. If it is too large, the aberration will be large, especially the off-axis aberration is difficult to eliminate, so it is difficult to ensure the depth of field of 0.1mm. Therefore, it is impossible to detect more than 28 pins at one time, which eventually leads to slow detection speed. One chip is detected in four sections, and it takes about 8 seconds to detect one chip;
[0004] 2. The production cost of the chip is high, because the equipment uses the top surface of the chip as the reference surface, the pins face up, and is placed flat on the detection platform of the equipment. In order to ensure the stability of the detection, it is necessary to ensure the processing flatness of the top surface , and the parallelism with the bottom surface of the pin, which will put forward higher requirements on the processing quality of the chip itself, which will lead to an increase in the production cost of the chip;
[0005] 3. The manufacturing cost of the objective lens is high, because the accuracy of the depth of field value of the objective lens is very high, the structure of the objective lens will become very complicated, and the processing cost is high;
[0006]4. The equipment is expensive
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[0024] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.
[0025] refer to figure 1 , figure 2 , the present invention is composed of an electromechanical control system, an optical image acquisition system and an automatic identification system, the electromechanical control system is respectively connected with the optical image acquisition system and the automatic identification system, and the optical image acquisition system is a symmetrical dual optical path transfer structure.
[0026] Such as figure 1 As shown, the optical image acquisition system includes an illumination light source box 6, three condenser mirrors 7, a light beam 8, a half mirror 9 and two rectangular prisms 17 arranged on the inner surface of the top of the main support frame 10 opposite to the half mirror 9. During detection, the light emitted by the tungsten lamp of the illuminating light source box 6 passes through thre...
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The invention discloses an IC chip pin coplanarity detecting instrument which comprises an optical image acquisition system and an automatic recognition software system, and is characterized in that the detecting instrument is also provided with an electromechanical controlling system including a chip feeding location mechanism, a light path switching mechanism and an electrical cabinet; the optical image acquisition system is an eudipleural double-light-path transmission structure, and the electromechanical controlling system is respectively connected with the optical image acquisition system and the automatic recognition software system. The detecting instrument has the advantages of rapid detecting speed, high qualification rate, low equipment cost, novel structure, small occupying area as well as easy installation and operation.
Description
technical field [0001] The invention relates to a detection device for an electronic integrated circuit module, in particular to a detection device for coplanarity of IC chip pins. Background technique [0002] With the rapid development of the electronic information industry, product performance testing is an important process on the production line of electronic integrated circuit devices, especially when SO-type IC chips are surface mounted, the mounting process has a common impact on the pins. Face to face puts forward quite high requirements. According to relevant surveys, there are currently manufacturers producing similar testing instruments in the world, but they only have large field of view testing instruments with chips within 20 feet and 28mm, but no domestic manufacturers with such equipment have been found. Japan Representative of similar products, its detection equipment has computer identification, image acquisition and light source lighting system. Its dete...
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IPC IPC(8): G01B11/00
Inventor萧泽新张杰韩文峰邓仕超张腾飞湛宾洲
OwnerGUILIN UNIV OF ELECTRONIC TECH