Cleaning equipment of semiconductor silicon chip and cleaning method thereof
Patent Information
- Authority / Receiving Office
- CN · China
- Current Assignee / Owner
- SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
- Publication Date
- 2009-09-16
- Estimated Expiration
- Not applicable · inactive patent
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Abstract
Description
technical field
[0001] The invention relates to the field of integrated circuit manufacturing, in particular to a semiconductor silicon wafer cleaning device and cleaning method. Background technique
[0002] With the continuous improvement of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, which also leads to the fact that if very small particles on silicon wafers are not cleaned, they will also affect the manufacture and performance of semiconductor devices. Therefore, Wafer cleaning processes are also becoming more and more important. Compared with the traditional immersion cleaning method, which uses immersion technology to process multiple silicon wafers at the same time, the single-wafer cleaning method can better control the distribution of the cleaning agent on the surface of the silicon wafer, and the high-speed rotation of the silicon wafer itself also makes the silicon The cleaning agent on the sur...