Cleaning equipment of semiconductor silicon chip and cleaning method thereof

A technology for cleaning equipment and semiconductors, which is applied in the directions of cleaning methods using liquids, cleaning methods using gas flow, cleaning methods and utensils, etc., which can solve the problem of high cost of cleaning equipment, reduce equipment costs, ensure production capacity, and improve production efficiency. Effect
CN101533760AInactive Publication Date: 2009-09-16SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT

Patent Information

Authority / Receiving Office
CN · China
Current Assignee / Owner
SHANGHAI INTEGRATED CIRCUIT RES & DEV CENT
Publication Date
2009-09-16
Estimated Expiration
Not applicable · inactive patent

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Abstract

The invention discloses cleaning equipment of a semiconductor silicon chip and a cleaning method thereof. The cleaning equipment comprises a plurality of process cavities which are connected in series, lift separators, rotatable platforms, mechanical arms and cleaning cantilevers, wherein the lift separators are arranged among a plurality of process cavities; the rotatable platforms are arranged in the plurality process cavities for supporting the silicon chip; the mechanical arms are arranged in the plurality of process cavities for conveying the silicon chip among the plurality of process cavities; the cleaning cantilevers are arranged in the plurality of process cavities, and are provided with nozzles which are connected with cleaning agent feed pipelines and inert gas feed pipelines; each process cavity is subjected to different cleaning steps, and is provided with the cleaning agent feed pipeline and the inert gas feed pipeline required by different cleaning steps, thereby greatly simplifying the equipment structure, reducing equipment cost, and improving production efficiency.
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Description

technical field

[0001] The invention relates to the field of integrated circuit manufacturing, in particular to a semiconductor silicon wafer cleaning device and cleaning method. Background technique

[0002] With the continuous improvement of integrated circuit manufacturing technology, the volume of semiconductor devices is becoming smaller and smaller, which also leads to the fact that if very small particles on silicon wafers are not cleaned, they will also affect the manufacture and performance of semiconductor devices. Therefore, Wafer cleaning processes are also becoming more and more important. Compared with the traditional immersion cleaning method, which uses immersion technology to process multiple silicon wafers at the same time, the single-wafer cleaning method can better control the distribution of the cleaning agent on the surface of the silicon wafer, and the high-speed rotation of the silicon wafer itself also makes the silicon The cleaning agent on the sur...

Claims

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