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Semiconductor temperature difference power generation device

A thermoelectric power generation, semiconductor technology, applied in the direction of generators/motors, electrical components, etc., can solve problems such as connecting together

Active Publication Date: 2013-10-23
GUANGDONG FUXIN ELECTRONICS TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] There are at least the following problems in the prior art: the above-mentioned heat sources are heat sources that can continuously provide heat, that is, the heat source needs to continuously replenish energy and consume fuel to maintain the heat supply, so that the hot end of the existing semiconductor power generation chip must be connected to the heat source. together and need to be constantly replenished with fuel or energy

Method used

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  • Semiconductor temperature difference power generation device
  • Semiconductor temperature difference power generation device
  • Semiconductor temperature difference power generation device

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Embodiment Construction

[0018] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without making creative efforts belong to the protection scope of the present invention.

[0019] figure 1 It is a structural schematic diagram of Embodiment 1 of the semiconductor thermoelectric power generation device of the present invention. As shown in the figure, the device includes: a heat absorber 20, a radiator 30 and a semiconductor power generation chip 40, wherein the heat absorber 20 includes a heat absorbing part 21 ...

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Abstract

The invention provides a semiconductor temperature difference power generation device which comprises a heat absorber, a heat radiator and a semiconductor power generation chip, wherein the heat absorber comprises a heat absorbing part and a heat transfer part, and the heat absorbing part is used for being in contact with a liquid heat source to absorb heat from the liquid heat source; the heat transfer part is used for conducting heat absorbed by the absorbing part; the heat radiator is positioned outside the liquid heat source and arranged on the heat transfer part of the heat absorber; the semiconductor power generation chip is positioned between the heat transfer part of the heat absorber and the heat radiator, the heat end of the semiconductor power generation chip is connected with the heat transfer part, and the cold end of the semiconductor power generation chip is connected with the heat radiator. The device stores a plurality of energy in the liquid by adopting high-temperature liquid as the heat source through the heat capacity of the high-temperature liquid to realize temperature difference power generation, thereby realizing continuous power generation.

Description

technical field [0001] Embodiments of the present invention relate to the technical field of power generation, and in particular to a semiconductor thermoelectric power generation device. Background technique [0002] The semiconductor thermoelectric power generation technology utilizes the Seebeck effect to form a temperature difference between the hot end and the cold end of the semiconductor power generation chip, thereby generating electricity. In the prior art, there are various heat sources provided to the hot end of the semiconductor power generation chip, such as: burning candle flame, heat released during fuel combustion, and waste heat and waste heat generated in various waste heat systems (such as: automobile exhaust pipe The heat released, the waste heat discharged from the flue, etc.). [0003] There are at least the following problems in the prior art: the above-mentioned heat sources are heat sources that can continuously provide heat, that is, the heat sourc...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H02N11/00
Inventor 高俊岭付国业冯斌
Owner GUANGDONG FUXIN ELECTRONICS TECH
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