Heat dissipation device based on semiconductor wafer and photovoltaic panel power station

Abstract

The invention provides a heat dissipation device based on a semiconductor wafer. The heat dissipation device comprises the semiconductor wafer and at least one heat conduction assembly. A fluid channel is formed in the flow guide heat transfer piece; the heat dissipation device can realize heat transfer between the first end surface and the second end surface of the semiconductor wafer; or the heat dissipation device can realize thermoelectric power generation between the first end surface and the second end surface of the semiconductor wafer. The heat dissipation device provided by the invention can quickly absorb the heat of the chip and the photovoltaic panel, and timely takes away the heat generated by the operation of the chip; the heat is provided for the semiconductor thermoelectricpower generation chip as a heat source; the semiconductor thermoelectric power generation purpose is achieved through the heat, and the effect of achieving two purposes at a time can be achieved. Theheat dissipation device can be widely applied to many fields such as big data centers, telecommunication machine rooms and photovoltaic power plants, can achieve thermoelectric power generation whileheat dissipation is conducted on photovoltaic panels, LED lamps and chips, and guarantees the efficient, stable and reliable operation of the photovoltaic panels, the LED lamps and the chips.

Description

technical field [0001] The invention relates to the technical field of thermal heat dissipation, in particular to a semiconductor wafer-based heat dissipation device and a photovoltaic panel power station. Background technique [0002] The power consumption of China's data centers exceeds the combined power generation of the Three Gorges and Gezhou Dam. Its staggering power consumption has led many researchers to study various chip cooling technologies, and liquid cooling may become the key to breaking the situation. According to the statistical data center, more than half of the energy consumption is used for cooling equipment, and cooling energy consumption has become the key to the bottleneck of the development of ranks. Although air cooling is still the most commonly used technology in the industry, more and more servers have begun to choose the "bath" cooling method to obtain lower energy consumption cooling methods, but "bath" cooling will also have a negative impact o...

AI Technical Summary

Problems solved by technology

[0019] The technical problem solved by the present invention is to provide a heat sink based on a semiconductor chip to solve the technical problems of poor heat dissipation performance of the chip heat sink in the prior art or lack of technical design for thermoelectric power generation

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