Uplink and downlink frame timing method of baseband chip multiple carrier sectors, baseband chip and system

A baseband chip and frame timing technology, applied in the field of communication, can solve problems such as inability to use, and achieve the effect of frame timing

Active Publication Date: 2010-07-28
HISILICON TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

For the baseband chip, since the data is transmitted between the baseband chip and the antenna through optical fiber, there will inevitably be a delay, so the baseband chip and the antenna cannot use the same frame timing

Method used

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  • Uplink and downlink frame timing method of baseband chip multiple carrier sectors, baseband chip and system
  • Uplink and downlink frame timing method of baseband chip multiple carrier sectors, baseband chip and system
  • Uplink and downlink frame timing method of baseband chip multiple carrier sectors, baseband chip and system

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Embodiment Construction

[0043] In order to make the purpose, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the drawings in the embodiments of the present invention. Obviously, the described embodiments It is a part of embodiments of the present invention, but not all embodiments. Based on the embodiments of the present invention, all other embodiments obtained by persons of ordinary skill in the art without creative efforts fall within the protection scope of the present invention.

[0044] A baseband chip is usually responsible for the data transmission of multiple carrier sectors. Multiple optical fibers between the baseband chip and the mid-radio frequency board carry the data transmission of different carrier sectors. For example, the baseband chip is responsible for the first carrier sector, the second carrier sector, the ...

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PUM

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Abstract

The invention provides an uplink and downlink frame timing method of baseband chip multiple carrier sectors, a baseband chip and a system. The uplink frame timing method comprises the following steps of: acquiring a reference frame timing of an antenna receiving data frame and a system frame number; acquiring the actual frame timing of the baseband chip receiving the data frame of each carrier sector, wherein the actual frame timing is equal to the reference frame timing adding a pre-acquired time delay corresponding to each carrier sector and between the baseband chip and an antenna; searching a header of the data frame of each carrier sector starting from the actual frame timing and beginning to receive the data frame of the carrier sector after the header of the data frame of the carrier sector is searched. The method, the baseband chip and the system provided in the embodiment of the invention realize the uplink frame timing of the data frame of the baseband chip multiple carrier sectors.

Description

technical field [0001] The embodiments of the present invention relate to the field of communication technologies, and in particular to a method for timing uplink and downlink frames of multi-loaded fans of a baseband chip, a baseband chip and a system. Background technique [0002] In a communication system, a sector refers to the smallest wireless coverage area covering a certain geographical area. Each sector uses one or more radio carriers to complete wireless coverage, and each radio carrier uses a certain carrier frequency point (Frequency). A sector and a carrier constitute the smallest service unit for providing user equipment (User Equipment, referred to as UE) access, that is, a cell (Cell). [0003] The carrier sector refers to the product of the number of carriers supported by a base station and the number of covered antenna directions. For example, a base station with "four carriers and three sectors" has 4×3=12 carrier sectors in total. [0004] One base stat...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H04B7/26
Inventor 李超
Owner HISILICON TECH
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