Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method

A protection hot plate method and a technology of thermal conductivity, applied in the direction of material thermal development, etc., can solve the problems of expensive thermal conductivity tester, the instrument cannot reach the index and measurement range, etc.

Inactive Publication Date: 2010-12-15
CHINA ACAD OF BUILDING RES
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, today's domestically produced instruments cannot meet the indicators and measurement ranges proposed by the national standards
And the price of importing a protective hot plate method thermal conductivity tester is too expensive

Method used

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  • Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method
  • Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method
  • Apparatus and method for measuring thermal coefficients by adopting guarded thermal plate method

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Embodiment Construction

[0015] Such as figure 1 As shown, the thermal conductivity tester is mainly composed of main body, cold source measurement and control system 1, heat source measurement and control system 2, intelligent measuring instrument 3, computer transmission 4, semiconductor refrigeration power supply 5 and regulated power supply 6 and other components.

[0016] (1) The main part is composed of hot plate 7, cold plate 8, and specimen pressing system. The hot plate 7 and the cold plate 8 are the core parts of the hardware of the instrument. The main purpose is to make the time and space necessary for the detection reach a stable state, and to make the structure of the hot plate and the cold plate reasonable, and the manufacturing process precise and reliable, which affects the performance of the instrument. great influence. The size of hot plate and cold plate is 300mm×300mm.

[0017] Hot plate 7 is made up of back protection hot plate, main heating plate, guard heating plate. The bac...

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Abstract

The invention relates to an apparatus and a method for measuring thermal coefficients by adopting a guarded thermal plate method. The apparatus mainly comprises a main part, a cold source measuring and controlling system, a thermal source measuring and controlling system, an intelligent measuring apparatus, a computer transmitter, a semiconductor refrigerating power supply and a voltage-stabilized source, wherein the main part comprises a thermal plate, a cold plate and a test piece pressing system, the thermal plate comprises a back guard thermal plate, a main heating plate and a guard heating plate, the main heating plate comprises a main heater and a metal equalizing-heating plate, the guard heating plate comprises a guard heater and a metal equalizing-heating plate, the cold plate comprises an aluminum plate, a semiconductor refrigerator and a water cooling system; the cold source measuring and controlling system and the thermal source measuring and controlling system respectively provide a cold source of the cold plate and a thermal source of the back guard thermal plate and comprise two sets of precise thermostatic water baths with same structure; each precise thermostatic water bath comprises a refrigerating loop, a water bath, a water pump, a stirring system, a heating temperature-controlling system, a water temperature display, and the like; and the semiconductor refrigerating power supply is independent of the main part, the cold source measuring and controlling system and the thermal source measuring and controlling system, thereby the measurement accuracy of a thermal coefficient measuring apparatus is improved.

Description

technical field [0001] The invention relates to an instrument and a method for measuring thermal conductivity, in particular to an instrument and a method for measuring thermal conductivity by a protective hot plate method. Background technique [0002] Thermal conductivity is one of the thermal physical properties of thermal insulation materials, and it is an important indicator to identify the thermal insulation performance of materials. In recent years, the state has paid more and more attention to building energy conservation. Accurately measuring the thermal conductivity of insulation materials plays a key role in the correct use of building insulation materials and the saving of building energy consumption. Therefore, it is particularly important to accurately determine this parameter. [0003] The methods for determining the thermal conductivity of building materials can be divided into two categories: steady-state methods and unsteady-state methods. The various fo...

Claims

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Application Information

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Patent Type & AuthorityApplications(China)
IPC IPC(8): G01N25/20
Inventor杨玉忠周辉
OwnerCHINA ACAD OF BUILDING RES