Radiator

A radiator and heat sink technology, applied in semiconductor devices, electrical solid devices, cooling/ventilation/heating transformation, etc., can solve the problem of large stress on the main chip and peripheral devices, poor heat dissipation effect, and poor reliability of the main chip and peripheral devices and other problems to achieve the effect of eliminating the influence of heat dissipation, increasing reliability and improving heat dissipation effect.

Active Publication Date: 2013-08-28
HUAWEI TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0007] In order to overcome the problem of poor reliability of the main chip and peripheral devices due to the use of a shared heat sink in the prior art due to the large stress on the main chip and peripheral devices, as well as the poor heat dissipation effect, the embodiment of the present invention Provides a heatsink

Method used

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Embodiment Construction

[0029] In order to make the object, technical solution and advantages of the present invention clearer, the implementation manner of the present invention will be further described in detail below in conjunction with the accompanying drawings.

[0030] The embodiment of the present invention is described by taking a single board and its main chip and peripheral devices as an example. like figure 1 In the single board shown, a plurality of main chips 2 are arranged on the single board 1 , and a plurality of peripheral devices 3 are arranged around each main chip 2 . Certainly, those skilled in the art know that the main chip 2 and peripheral devices can be any heat generating devices. In this example, the main chip 2 is defined as the first heat source, and the peripheral device 3 is defined as the second heat source.

[0031] like figure 2 As shown, a radiator according to an embodiment of the present invention includes a sub-radiator 4, a connecting device 8 and a common b...

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Abstract

A heat sink comprising a sub heat sink, a connecting device, and a common support is provided. The sub heat sink is connected to the common support through the connecting device. The sub heat sink has a first heat conductive surface in contact with a first heat source, so as to dissipate the heat of the first heat source. The common support has a second heat conductive surface in contact with a second heat source, so as to dissipate the heat of the second heat source. The second heat conductive surface and the sub heat sink are located at different positions on the common support. The technical solution relates to the field of communication and solves the heat dissipation problem of a first heat source and a second heat source, so that the first heat source and the second heat source can be installed on one same plane, thereby effectively reducing a long-term pressure on the first heat source and significantly improving the reliability of the first heat source as well as enhancing the overall heat dissipation effect of the heat sink.

Description

technical field [0001] The invention relates to the field of electronic products, in particular to a radiator. Background technique [0002] Single boards are widely used in the field of electronic products. One or more main chips are usually arranged on a single board, and multiple peripheral devices are arranged around each main chip on the single board. Due to the adjacent layout of the peripheral devices and the main chip, it is impossible to add independent heat sinks to dissipate heat from the main chip and peripheral devices respectively. Therefore, it is necessary to use a shared radiator solution to dissipate heat from the main chip and peripheral devices. [0003] At present, the existing shared radiator includes a substrate and a heat sink. The substrate is arranged above all main chips and all peripheral devices. Between the substrate and the main chip, and between the substrate and peripheral devices, respectively, are filled with thermal pads to eliminate The...

Claims

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Application Information

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Patent Type & AuthorityPatents(China)
IPC IPC(8): H01L23/40H01L23/367H05K7/20
CPCH01L23/36H01L23/4006H01L23/427H01L2924/0002H01L2924/00H01L23/3672H01L23/40
Inventor刘贞贞侯晓静池善久
OwnerHUAWEI TECH CO LTD