Encapsulation sheet, flat panel display device thereof, and method for manufacturing the flat panel display device
A flat-panel display device and encapsulation chip technology, which is applied in semiconductor/solid-state device manufacturing, transportation and packaging, thin material processing, etc., and can solve the problems that the display unit will be polluted, time-consuming, complicated, etc.
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[0026] Embodiments of the invention will now be described more fully with reference to the accompanying drawings, which illustrate exemplary embodiments.
[0027] figure 1 is a cross-sectional view of the encapsulation sheet 10 according to one embodiment.
[0028] The encapsulating sheet 10 according to an embodiment of the present invention has a structure in which a first sheet 13 having an absorber 14 formed thereon and a second sheet 11 having a sealant 12 formed thereon are combined. The absorbent 14 is formed on the first sheet 13 and the sealant 12 is formed on the second sheet 11 to leave a gap 12a into which the absorbent 14 can enter (see Figure 3A ), the encapsulating sheet 10 is produced by combining them. In this way, the encapsulating sheet 10 capable of containing the sealant 12 and the absorber 14 formed on the flat panel display substrate 20 at the same time can be realized.
[0029] A method of manufacturing the encapsulation sheet 10 will now be describ...
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