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Thin film transistor and manufacturing method therefor

A technology of thin film transistors and manufacturing methods, applied in the direction of transistors, semiconductor/solid-state device manufacturing, semiconductor devices, etc., to achieve the effect of reducing contact resistance

Inactive Publication Date: 2014-03-12
AU OPTRONICS CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Gate insulating layer covers the gate

Method used

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  • Thin film transistor and manufacturing method therefor
  • Thin film transistor and manufacturing method therefor
  • Thin film transistor and manufacturing method therefor

Examples

Experimental program
Comparison scheme
Effect test

experiment example 1

[0042] A thin film transistor is manufactured according to the steps in the above embodiments, and ITO is used as the metal oxide conductive layer of the source S and the drain D. The thickness of the ITO is 500 angstroms, and the thickness of the metal layer of the source S and the drain D is 2000 angstroms. Before coating the solution-state metal-semiconductor material, measure the resistance of the S / D wire, which is the resistance of the S / D wire before sintering in Table 1. Next, after coating the solution-state metal-semiconductor material and performing one sintering at 370° C., the resistance of the S / D wire is measured again, which is the resistance of the S / D wire after sintering in Table 1.

experiment example 2

[0044] Similar to Experimental Example 1, the thickness of the metal layer of the source S and the drain D is 2000 angstroms, and the difference is that the thickness of ITO is 750 angstroms. Likewise, the resistance of the S / D wires was measured before coating the solution-state metal-semiconductor material. Next, after applying the solution-state metal-semiconductor material and performing sintering at 370° C. twice, the resistance of the S / D wire was measured again, and the results are shown in Table 1.

experiment example 3

[0046] Similar to Experimental Example 1, the thickness of the metal layer of the source S and the drain D is 2000 angstroms, and the difference is that the thickness of ITO is 1300 angstroms. Likewise, the resistance of the S / D wires was measured before coating the solution-state metal-semiconductor material. Next, after coating the solution-state metal-semiconductor material and firing once at 370° C., the resistance of the S / D wire was measured again, and the results are shown in Table 1.

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Abstract

The invention provides a thin film transistor and a manufacturing method therefor. The thin film transistor comprises a grid, a grid insulating layer, a source electrode, a drain electrode, a metal oxide semiconductor layer, a first metal oxide conducting layer and a second metal oxide conducting layer. The grid is covered by the grid insulating layer. The source electrode and the drain electrode are arranged on the gate insulating layer. The grid insulating layer on the source electrode, the drain electrode and the grid is covered by the metal oxide semiconductor layer to function as a channel layer. The first metal oxide conducting layer is arranged between the source electrode and the metal oxide semiconductor layer, so that the source electrode and the metal oxide semiconductor layer are isolated from each other. The second metal oxide conducting layer is arranged between the drain electrode and the metal oxide semiconductor layer, so that the drain electrode and the metal oxide semiconductor layer are isolated from each other.

Description

technical field [0001] The present invention relates to a thin film transistor and a manufacturing method thereof, in particular to a thin film transistor which can avoid the oxidation phenomenon of the metal electrode surface of the source (source) and the drain (drain) after sintering of the solution state metal oxide and reduce the resistance. Thin film transistor and method of manufacturing the same. Background technique [0002] With the development of flat-panel display technology, thin film transistor liquid crystal display (TFT-LCD) with superior characteristics such as high image quality, good space utilization efficiency, low power consumption, and no radiation has gradually become the mainstream of the market . The existing thin film transistor manufacturing method is to form a gate on the substrate first, then deposit an insulating layer (insulating layer) and a semiconductor layer as a channel layer (channel) on the substrate to cover the gate, and then A sour...

Claims

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Application Information

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IPC IPC(8): H01L29/786H01L21/336
CPCH01L29/41733H01L29/66969H01L29/7869
Inventor 林亮宇郑君丞
Owner AU OPTRONICS CORP