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A chip applied to gpon optical modules and bobs

A technology of optical modules and chips, which is applied in the direction of electromagnetic transceivers, etc., can solve the problems of occupying layout space and achieve the effects of simplified design, space saving, and high driving voltage

Active Publication Date: 2019-07-12
SUZHOU SUTUO COMM TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, in the actual application of GPON optical modules and BOBs, it still takes up a lot of layout space

Method used

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  • A chip applied to gpon optical modules and bobs
  • A chip applied to gpon optical modules and bobs
  • A chip applied to gpon optical modules and bobs

Examples

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Embodiment Construction

[0030] Embodiments of the present invention are described below through specific examples, and those skilled in the art can easily understand other advantages and effects of the present invention from the content disclosed in this specification. The present invention can also be implemented or applied through other different specific implementation modes, and various modifications or changes can be made to the details in this specification based on different viewpoints and applications without departing from the spirit of the present invention.

[0031] It should be noted that the diagrams provided in this embodiment are only schematically illustrating the basic idea of ​​the present invention, so that only the components related to the present invention are shown in the diagrams rather than the number, shape and Dimensional drawing, the type, quantity and proportion of each component can be changed arbitrarily during actual implementation, and the component layout type may als...

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Abstract

The invention provides a chip applied to a GPON optical module and a BOB. The chip comprises a main chip circuit and an APD boosted circuit, wherein the APD boosted circuit is integrated in the chip. The chip applied to the GPON optical module and the BOB can achieve basic functions of a common optical module chip, and can also provide high-drive voltage needed by GPONBOSA. The boosted circuit is integrated in the chip, so that the design of a main chip peripheral circuit is simplified, and space is saved for a circuit board. Looped control in the prior art needs three pins, the chip only needs one voltage output pin, and accordingly application design of the GPON optical module and the BOB is greatly facilitated.

Description

technical field [0001] The invention relates to a chip, in particular to a chip applied to a GPON optical module and a Bosa on Board (BOB). Background technique [0002] Gigabit-Capable Passive Optical Network (GPON) was first proposed by the FSAN organization in September 2002. Based on this, ITU-T completed ITU-T G.984.1 and G. The formulation of 984.2 completed the standardization of G.984.3 in February and June 2004, thus finally forming the standard family of GPON. The basic structure of the equipment based on GPON technology is similar to that of the existing PON. It is also composed of the optical line terminal (OpticalLine Terminal, OLT) at the central office, and the optical network terminal or optical network unit (ONT / ONU) at the user end to connect the first two devices. It consists of an Optical Distribution Network (ODN) composed of a single mode fiber (Single Mode Fiber) and a passive optical splitter (Splitter) and a network management system. [0003] In t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04B10/40
Inventor 林金文
Owner SUZHOU SUTUO COMM TECH
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