Minitype welding pin inner hole grinding device

Abstract

The invention discloses a minitype welding pin inner hole grinding device and relates to inner hole grinding devices. The minitype welding pin inner hole grinding device is provided with a working table, a welding pin storage disc, a grinding groove, a stand column beam, an X-axis guide rail, an X-axis servo motor, an X-axis lead screw, an X-axis movable block, a Z-axis rotary motor, a Z-axis rotary block, a Z-axis guide rail, a Z-axis servo motor, a Z-axis lead screw, a spindle motor, a spindle, a welding pin clamping head, an ultrasonic transducer, a rotary motor and a magnet. By the adoption of the minitype welding pin inner hole grinding device, polishing of a minitype welding pin inner hole can be achieved, surface quality of the welding pin inner hole is improved remarkably, so that solder can be kept unblocked when a welding pin is used for welding and welding quality is guaranteed. Furthermore, the structure is simple, actual production can be conducted easily, and the welding pin clamping head is of a pneumatic type, small, convenient to use and capable of achieving clamping quickly. Meanwhile, streamline production enables machining time to be shortened greatly and work efficiency to be improved remarkably.

Description

technical field [0001] The invention belongs to the technical field of polishing, and relates to an inner hole grinding device, in particular to a micro welding pin inner hole grinding device. Background technique [0002] Welding technology is widely used in engineering, and the size of welded parts is getting smaller and smaller, but the requirements for welding accuracy are getting higher and higher. At present, the rapid development of 3D printing technology has promoted the miniaturization of solder pins. In order to achieve small-size and high-precision welding, micro solder pins are used more and more widely. However, due to the small size of the miniature soldering pins, some soldering pins have only micro-nano-level inner holes and are tapered, so the inner holes of the soldering pins cannot be polished by general processing devices and processing methods, and the surface quality of the inner holes is difficult to guarantee. . If the surface of the inner hole of t...

AI Technical Summary

Problems solved by technology

However, due to the small size of the micro welding pins, the inner holes of some welding pins are only micro-nano and tapered, so it is impossible to polish the inner holes of the welding pins with general processing devices and processing methods, and the sur

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