Polyimide Film

A technology of polyimide film and gel film, which is applied in the direction of film/sheet adhesives, layered products, metal layered products, etc., and can solve the problem of dimensional changes in the diagonal direction of flexible metal laminates Insufficient improvement, poor connection between components and substrates, and failure to take film strain into consideration, achieve the effect of small dimensional change rate, stable dimensional change rate, and improved positional deviation

Active Publication Date: 2014-12-31
DUPONT TORAY CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Therefore, if the dimensional change after the formation of fine wiring becomes large, there is a problem that the component and the substrate cannot be connected satisfactorily due to deviation from the component mounting position at the design stage.
Although Patent Document 3 describes a method for reducing the anisotropy of a polyimide film, it does not take into account the influence of film strain due to the influence of residual stress in the tenter annealing process. Insufficient improvement of dimensional change in the diagonal direction of laminated boards

Method used

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Embodiment

[0105] Hereinafter, the present invention will be described in more detail by citing examples, but the present invention is not limited by these examples, and many modifications made within the technical idea of ​​the present invention can also be utilized by those skilled in the art.

[0106] Hereinafter, methods for measuring various characteristics of the present invention will be described.

[0107] (1) AI (45, 135)

[0108]The propagation velocity V of the ultrasonic pulse in the present invention was measured using SST-2500 (Sonic Sheet Tester) manufactured by Nomura Corporation. Using SST-2500, ultrasonic velocities in 16 directions every 11.25° in the surface direction of the film from 0 to 180° (0° is parallel to the MD direction) were automatically measured. Among the obtained velocities in each direction, the anisotropy index (AI) shown in Formula 1 was obtained from ultrasonic velocities V45 and V135 at 45° and 135° based on the MD direction. Using the films obta...

Synthetic example 2

[0119] Prepare pyromellitic dianhydride (molecular weight 218.12) / 3,3',4,4'-biphenyltetracarboxylic dianhydride (molecular weight 294.22) / 4 according to the molar ratio of 65 / 35 / 80 / 20, 4'-diaminodiphenyl ether (molecular weight 200.24) / p-phenylenediamine (molecular weight 108.14), in DMAc (N,N-dimethylacetamide), make 20% by weight solution and polymerize to obtain 3500 poise poly Amic acid solution.

Synthetic example A

[0121] Add 1,3-bis(4-aminophenoxy)benzene into the solvent dimethylacetamide and stir until it dissolves. Thereafter, 4,4'-dioxydiphthalic anhydride was added and stirred to obtain a polyamic acid solution. The solid content in dimethylacetamide was 15%, and Tg was 217°C.

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Abstract

The present invention provides a polyimide film, a glue film restraining the size change in a diagonal direction and a flexible metal laminating plate formed by adhering a metal foil. The diagonal is characterized in that the width of the film is greater than 1 m, when the propagation velocity V of an ultrasonic pulse of which the film orientation angle theta is 45-degree and 135-degree by taking the film mechanical transmission direction as the reference, is measured, the anisotropic index represented by formula 1 is below 12 in the overall width, and the size change rate of the flexible metal laminating plate in the diagonal (45-degree, 135-degree) direction before and after etching processing in the overall width is about -0.05-0.05%. A thermoplastic polyimide layer of which the thickness is 0.5-20 micrometers is formed on at least a single surface of the polyimide film.

Description

technical field [0001] The present invention relates to a polyimide film. It also relates to an adhesive film having thermoplastic polyimide on at least one side of the polyimide film. Furthermore, it also relates to the flexible metal laminated board obtained by bonding metal foil to this adhesive film. Background technique [0002] Flexible printed circuit boards (FPC: Flexible printed circuits) are generally formed using various insulating materials, and are manufactured by using a flexible insulating film as a substrate and bonding metal foil to the substrate with various adhesive materials. Bonded to the surface of the substrate by heating and pressure bonding. As the insulating film, a polyimide film excellent in heat resistance and electrical insulation is preferably used. As the adhesive material, thermosetting adhesives such as epoxy-based and acrylic-based adhesives are generally used (hereinafter, FPCs using these thermosetting adhesives are also referred to as...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J7/02C09J179/08C08G73/10B32B15/08
Inventor 秋山聪户井田纪子大场大史
Owner DUPONT TORAY CO LTD
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