84results about How to "Suppresses dimensional changes" patented technology

A magnetic recording medium is provided that can ensure stable recording and reproducing characteristics with little off-track even when a track density in the direction of width of the tape is very high and 50 lines / mm or more, an off-track margin is 5 μm or smaller, and a variation that is permitted at maximum as a dimensional variation in the direction of width of the tape itself due to environmental factors such as the change of temperature and humidity, the change of tension, a creep, etc. is small as low as 0.10% or less. Assuming that Young's modulus in the direction of width of a non-magnetic substrate is X and Young's modulus in the direction of width of the back layer is Y, X is 850 kg / mm2 or more, or when X is less than 850 kg / mm2, X×Y is 6×105 or more, and assuming that Young's modulus in the direction of width of a layer including a magnetic layer is Z, Y / Z is not larger than 6.0.

A method for manufacturing a polishing pad containing substantially spherical cells and having high thickness accuracy includes preparing a cell-dispersed urethane composition by a mechanical foaming method; continuously discharging the cell-dispersed urethane composition from a single discharge port to a substantially central portion in the width direction of a face material A, while feeding the face material A; laminating a face material B on the cell-dispersed urethane composition; then uniformly adjusting the thickness of the cell-dispersed urethane composition by thickness adjusting means; curing the cell-dispersed urethane composition with the thickness adjusted in the preceding step without applying any additional load to the composition so that a polishing sheet including a polyurethane foam is formed; and cutting the polishing sheet.

A semiconductor acceleration sensor device has an acceleration sensor chip and a hollow package to house the acceleration sensor chip. A concave section is formed in a predetermined area on a bottom face inside the package. The semiconductor acceleration sensor device also has a low elasticity element with adhesiveness. The low elasticity element is filled in the concave section. The acceleration sensor chip is mounted on the low elasticity element. The adhesive surface between the low elasticity element and the acceleration sensor chip is higher than the bottom face.

The present invention provides a decorative sheet which enables to produce a decorative molded article with excellent design property, even if the sheet is employed to a decorative molded article requiring deep drawing, and the decorative molded article using the decorative sheet. There is provided a decorative sheet used by forming a curved portion by injection-molding a base material resin to be integrated with the base material resin. The decorative sheet is formed by integrally laminating a base material-side adhesion layer, a porous decor sheet, a protective layer-side adhesive layer, and a transparent surface protective layer from the rear surface side in this order. The protective layer-side adhesive layer is formed by curing a moisture curing type of transparent polyurethane adhesive and the surface protective layer contains polymethylmethacrylate, a composite resin of polycarbonate and polybutylene terephthalate or a composite resin of polycarbonate and polyethylene terephthalate as a main component, and has a glass transition point of 90 to 130[deg.] C. There is provided a decorative molded article obtained by forming a curved portion on a decorative sheet by injection-molding a base material resin to a rear surface side of the decorative sheet in the mold.

A negative resist composition is provided comprising (A) a polymer comprising recurring units having an acid-eliminatable group and recurring units capable of generating acid upon exposure and (B) a carboxylic acid onium salt. When the negative resist composition is processed by the microprocessing technology, especially EB lithography, it forms a pattern having a very high resolution and minimal LER.

The present invention provides a method for producing a substrate for a flexible circuit board, which includes: providing a multi-layer insulating resin layer including an insulating layer and an adhesive layer; and The metal foil is laminated to the insulating layer of the multilayer insulating resin layer through an adhesive layer at a temperature of the glass transition temperature of the layer.

In a motor, a motor case includes a first case and a second case separable from each other in a direction of an axis of a rotation shaft of a rotor. The first case and the second case each have cut-away portions extending parallel to the axis from a separation edge (open side edge) thereof. The separation edges of the first and second cases each have abutment portions not formed with the cut-away portions, and the abutment portions of the first case respectively abut against the abutment portions of the second case. The cut-away portions cooperatively define a plurality of windows disposed in a periphery of the motor case. The stator has a plurality of bulges projecting radially outward from a peripheral surface thereof in association with the windows.

The present invention provides a polyimide film with a small rate of dimensional change in the manufacturing process when used in FPC. In particular, the object is to produce a metal-clad laminate with few abnormal parts such as wrinkles, and obtain dimensional change at a high yield. FPC with a small rate can solve this problem with the following polyimide film, which is a polyimide film having a tan δ peak temperature equal to or greater than 320° C. and less than 380° C. in the measurement of dynamic viscoelasticity, and is characterized in that : The maximum slack of the film is 13mm or less.

According to an embodiment of the present invention, a printed wiring board manufacturing apparatus being provided with a drum unit having a processing cylinder that holds the printed wiring board material and comprises a cylinder outer circumference and a processing unit that performs processing on the printed wiring board material held by the processing cylinder.