Method of making substrate for flexible circuit board

一种挠性电路板、基底的技术，应用在电路基板材料、印刷电路、印刷电路等方向，能够解决实际尺寸与设计尺寸改变等问题，达到抑制尺寸变化的效果
CN1627883AInactive Publication Date: 2005-06-15NITTO DENKO CORP
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Patent Information

Authority / Receiving Office
CN · China
Patent Type
Applications(China)
Current Assignee / Owner
NITTO DENKO CORP
Publication Date
2005-06-15
Estimated Expiration
Not applicable · inactive patent

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Abstract

The present invention provides a method for producing a substrate for a flexible circuit board, which includes: providing a multi-layer insulating resin layer including an insulating layer and an adhesive layer; and The metal foil is laminated to the insulating layer of the multilayer insulating resin layer through an adhesive layer at a temperature of the glass transition temperature of the layer.
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Description

technical field

[0001] The present invention relates to a method for producing a flexible-circuit substrate for the production of flexible printed wiring boards. Background technique

[0002] Flexible printed wiring boards have been used in various electronic or electrical equipment. For the purpose of reducing the size and weight of these electronic and electrical devices, wiring patterns on flexible printed wiring boards have gradually been formed at greater densities, and flexible printed wiring boards have come to have minimized components, The part is mounted on the wiring board at a higher density.

[0003] Usually, the wiring pattern on the flexible printed wiring board is formed by laminating copper foil as a metal foil to an insulating layer such as a polyimide film by means of a thermosetting adhesive under heat, further raising its temperature to It is formed by curing a thermosetting adhesive and then etching a copper foil (for example, see Patent Document 1). ...

Claims

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