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Method of making substrate for flexible circuit board

一种挠性电路板、基底的技术，应用在电路基板材料、印刷电路、印刷电路等方向，能够解决实际尺寸与设计尺寸改变等问题，达到抑制尺寸变化的效果

Inactive Publication Date: 2005-06-15
NITTO DENKO CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] However, after the copper foil is selectively removed by etching, there is a significant change between the actual size of the FPC and the design size due to the internal stress accumulated in the FPC
Therefore, there are cases where the components to be mounted are mounted at positions deviated from the designed positions, so that it is impossible to connect the mounted components to the flexible printed wiring board

Method used

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  • Method of making substrate for flexible circuit board
  • Method of making substrate for flexible circuit board
  • Method of making substrate for flexible circuit board

Examples

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Effect test

Embodiment 1-3 and comparative example 1-2

[0063] The flexible circuit substrates of Examples 1-3 were produced according to the first or second embodiment, and the flexible circuit substrates of Comparative Examples 1-2 were also produced. The metal foil 3 of the produced flexible circuit substrate was etched, and then the dimensional change of the flexible printed wiring board was evaluated.

[0064] In Example 3 and Comparative Example 2, the substrate 100 for a single-sided flexible circuit board was used. In Examples 1-2 and Comparative Example 1, the substrate 101 for a double-sided flexible circuit board was used.

[0065] Table 1 shows the properties of the insulating layer 1 in each of the substrate 100 for a single-sided flexible circuit board and the substrate 101 for a double-sided flexible circuit board used in Examples 1-3 and Comparative Examples 1-2. Material and thickness (μm).

[0066] Table 2 shows the adhesive layer 2 of each of the substrate 100 for a single-sided flexible circuit board and the s...

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PUM

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Abstract

The present invention provides a method for producing a substrate for a flexible circuit board, which includes: providing a multi-layer insulating resin layer including an insulating layer and an adhesive layer; and The metal foil is laminated to the insulating layer of the multilayer insulating resin layer through an adhesive layer at a temperature of the glass transition temperature of the layer.

Description

technical field [0001] The present invention relates to a method for producing a flexible-circuit substrate for the production of flexible printed wiring boards. Background technique [0002] Flexible printed wiring boards have been used in various electronic or electrical equipment. For the purpose of reducing the size and weight of these electronic and electrical devices, wiring patterns on flexible printed wiring boards have gradually been formed at greater densities, and flexible printed wiring boards have come to have minimized components, The part is mounted on the wiring board at a higher density. [0003] Usually, the wiring pattern on the flexible printed wiring board is formed by laminating copper foil as a metal foil to an insulating layer such as a polyimide film by means of a thermosetting adhesive under heat, further raising its temperature to It is formed by curing a thermosetting adhesive and then etching a copper foil (for example, see Patent Document 1). ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B32B37/12H05K1/00H05K1/03H05K3/02H05K3/38
CPCB32B37/12B32B37/1207B32B2307/734B32B2309/02B32B2457/08H05K1/0393H05K3/022H05K3/386H05K2201/0355H05K2203/068Y10T428/31681
Inventor 徐竞雄三宅康文
Owner NITTO DENKO CORP
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