Novel polyimide film and use thereof

A technology of polyimide film and polyamic acid, which is applied in the direction of heat activated film/sheet, film/sheet adhesive, synthetic resin layered products, etc. Effect

Active Publication Date: 2008-04-16
KANEKA CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0016] However, in the technology of Patent Document 2 or Patent Document 3, although it is attempted to improve the dimensional change by changing the conditions of thermal lamination, there is a limit when high dimensional accuracy is required.

Method used

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  • Novel polyimide film and use thereof
  • Novel polyimide film and use thereof
  • Novel polyimide film and use thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0209] Hereinafter, the present invention will be specifically described by way of examples, but the present invention is not limited to these examples. Various alterations, modifications and changes may be made by those skilled in the art without departing from the scope of the present invention. It should be noted that the glass transition temperature of thermoplastic polyimide, storage modulus, tensile modulus, hygroscopic expansion coefficient and linear expansion coefficient of polyimide film in Synthetic Examples, Examples and Comparative Examples , The dimensional change rate of the flexible metal foil-clad laminate, the metal foil peel strength, and the evaluation methods of the moisture absorption welding resistance are as follows.

[0210] [Glass transition temperature]

[0211] The glass transition temperature was measured using DMS6100 manufactured by SII Nano Technology, and the inflection point of the storage elastic modulus was used as the glass transition temp...

Synthetic example 1

[0247] [Synthesis Example 1: Synthesis of Thermoplastic Polyimide Precursor]

[0248] Add 780 g of N,N-dimethylformamide (hereinafter also referred to as "DMF") and 115.6 g of BAPP to a glass flask with a capacity of 2000 ml, and slowly add 3, 3', 4, 4 78.7 g of '- biphenyl tetracarboxylic dianhydride (it may be called "BPDA" hereafter). Next, 3.8 g of 3,3', 4,4'- ethylene glycol dibenzoate tetracarboxylic dianhydride (it is also called "TMEG" hereafter) was added, and it stirred under ice bath for 30 minutes. Separately, a solution in which 2.0 g of TMEG was dissolved in 20 g of DMF was prepared, and this solution was gradually added to the above-mentioned reaction solution and stirred while paying attention to the viscosity. When the viscosity reached 3000 poise (300 Pa.s), the addition and stirring were stopped to obtain a polyamic acid solution.

[0249] The obtained polyamic acid solution was poured onto a 25 μm PET film (Cerapeel HP, product of TOYO Metallizing Co., Lt...

Embodiment 1～4

[0250] [Examples 1-4: Synthesis of polyimide film]

[0251] With the inside of the reaction system kept at 5°C, 4,4'-diaminodiphenyl ether (hereinafter also referred to as "4,4'-ODA") and BAPP, for stirring. After visually confirming the dissolution, 3,3',4,4'-benzophenonetetracarboxylic dianhydride (hereinafter also referred to as "BTDA") was added at the molar ratio shown in Table 1, and stirred for 30 minutes.

[0252] [Table 1]

[0253]

4.4'-ODA

BAPP

BTDA

PMDA

(1st)

p-PDA

PMDA

(2nd)

Example 1

20

30

25

20

50

52

Example 2

20

30

30

15

50

52

Example 3

10

40

20

25

50

52

Example 4

10

40

25

20

50

52

[0254] Next, pyromellitic dianhydride (hereinafter also referred to as P...

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Abstract

The present invention provides a polyimide film capable of suppressing dimensional changes caused by thermal stress, particularly a polyimide film having a function of suppressing thermal deformation of the material when a metal layer and a polyimide film are laminated by a lamination method. Imide film and its utilization. The polyimide film of the present invention (1) has an inflection point of the storage modulus in the range of 270° C. to 340° C., and (2) the peak of the value tanδ obtained by dividing the loss modulus by the storage modulus is at 320° C. In the range of ℃~410℃, (3) the storage modulus at 380℃ is 0.4GPa~2.0GPa, (4) the storage modulus α1(GPa) at the inflection point and the storage modulus α2 at 380℃ (GPa) is in the range of 85≥{(α1-α2) / α1}×100≥65. Thermal deformation occurring on the material when the metal layer and the polyimide film are laminated by a lamination method is thereby suppressed.

Description

technical field [0001] The present invention relates to a polyimide film and its utilization, and more particularly to a polyimide film capable of suppressing dimensional changes occurring in the manufacturing process of a flexible metal-clad laminate and its utilization. It further relates to a polyimide film capable of obtaining a flexible metal-clad laminate having excellent dimensional stability when an adhesive layer is provided and a metal foil is laminated by a thermal lamination method, and its utilization. Background technique [0002] In recent years, with the reduction in weight, miniaturization, and high density of electronic products, the demand for various printed wiring boards has increased, and among them, the demand for flexible printed wiring boards (hereinafter also referred to as "FPC") has grown particularly rapidly. FPC has a structure in which a circuit made of metal foil is formed on an insulating film. [0003] A flexible laminate such as the aforem...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08J5/18C09J7/02B32B15/088B32B27/34C08G73/10C08L79/08C09J7/22C09J7/25C09J7/35
CPCH05K3/022H05K3/386B32B15/08C09J2479/086C08L79/08C08G73/1071H05K1/0346C09J2201/61C09J2479/08C09J7/0282C09J7/0242H05K2201/0154C09J7/35C09J7/22C09J7/25Y10T428/2826Y10T428/31681C09J2301/304C08J5/18C08L77/00B32B27/34
Inventor 菊池刚金城永泰
Owner KANEKA CORP
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