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A kind of low-viscosity heat-conducting epoxy pouring glue and preparation method thereof

An epoxy casting and low viscosity technology, which is applied in the field of insulating materials, can solve the problems of high viscosity, low impact performance, and difficulty in pouring, etc., and achieve the effects of improving thermal conductivity, improving impact performance, and preventing settlement

Active Publication Date: 2016-11-30
GUILIN ELECTRICAL EQUIP SCI RES INST
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The existing problems are: (1) due to the addition of a large amount of inorganic powder, the movement between the polymers of the system is hindered, the viscosity of the system becomes very large, the operation is difficult, and it is not easy to pour; (2) due to the high viscosity, vacuum defoaming The bubbles in the process cannot be fully discharged from the system, and there are many defects in the cured system, resulting in a greatly reduced impact performance; (3) Due to the large size of the insulator of the power transmission and transformation equipment, the powder in the system during the curing process settles due to the action of gravity , leading to a large difference in the powder content of the upper and lower parts of the cured insulator, which affects the product quality of power transmission and transformation equipment
However, due to the regular shape of spherical powder particles, compared with non-spherical powder particles, it is not easy to form effective heat conduction channels in the system, so that the thermal conductivity of the cured insulator is not high; at the same time, due to the low viscosity, the curing process settles Faster, the problem of inconsistent powder content on the upper and lower sides of the insulator is more prominent

Method used

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  • A kind of low-viscosity heat-conducting epoxy pouring glue and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] The components of the thermally conductive epoxy casting glue in this example are as follows:

[0029] A component, bisphenol A type epoxy resin 40g, novolac type epoxy resin 25g, alicyclic epoxy resin 35g;

[0030] Component B, 80g of methyl hexahydrophthalic anhydride;

[0031] Component C, 40g of spherical alumina powder with a particle diameter of 10 microns, and 160g of non-spherical alumina powder with a particle diameter of 32 microns;

[0032] The preparation process of the thermally conductive epoxy casting glue in this example is as follows

[0033] Ⅰ. Weigh 40g of bisphenol A epoxy resin, 25g of novolac epoxy resin, and 35g of cycloaliphatic epoxy resin, and mix them at 15°C for 30 minutes to form component A;

[0034] Ⅱ. Take 80g of methyl hexahydrophthalic anhydride as component B of anhydride curing agent

[0035] Ⅲ. Add component B to component A and mix for 40 minutes at 20°C;

[0036] Ⅳ. Take 40g of spherical alumina powder with a particle size of 1...

Embodiment 2

[0040] The components of the thermally conductive epoxy casting glue in this example are as follows:

[0041] A component, bisphenol F type epoxy resin 45g, glycidylamine type epoxy 55g;

[0042] Component B, tetrahydrophthalic anhydride 40g, methyl hexahydrophthalic anhydride 30g, methyl nadic anhydride 30g;

[0043] Component C, 55g of spherical silicon micropowder with a particle diameter of 10 microns, 40g of spherical boron nitride powder with a particle diameter of 4 microns, and 285g of non-spherical silicon micropowder with a particle diameter of 32 microns;

[0044] The preparation process of the thermally conductive epoxy casting glue in this example is as follows

[0045] Ⅰ. Weigh 45g of bisphenol F-type epoxy resin and 55g of glycidylamine-type epoxy resin, and mix them at 20°C for 25 minutes to form component A;

[0046] Ⅱ. Take 40g of tetrahydrophthalic anhydride, 30g of methyl hexahydrophthalic anhydride, and 30g of methyl nadic anhydride as component B of the...

Embodiment 3

[0052] The components of the thermally conductive epoxy casting glue in this example are as follows:

[0053] A component, bisphenol A type epoxy resin 100g;

[0054] Component B, 50g of hexahydrophthalic anhydride, 40g of methyl tetrahydrophthalic anhydride;

[0055] Component C, 40g of spherical silica powder with a particle size of 10 microns, 40g of spherical alumina powder with a particle size of 10 microns, 25g of spherical aluminum nitride powder with a particle size of 7 microns, and non-spherical alumina powder with a particle size of 32 microns Powder 245g;

[0056]The preparation process of the thermally conductive epoxy casting glue in this example is as follows

[0057] Ⅰ. Weigh 100g of bisphenol A type epoxy resin and mix it at 30°C for 25 minutes to form component A;

[0058] Ⅱ. Take 50g of hexahydrophthalic anhydride and 40g of methyltetrahydrophthalic anhydride as component B of the anhydride curing agent;

[0059] Ⅲ. Add component B to component A and mix...

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Abstract

The invention discloses low-viscosity heat-conducting casting rubber and a preparation method thereof, and belongs to the field of insulating materials. The casting rubber comprises the following components: 100 parts of epoxy resin A, 80-120 parts of an anhydride curing agent B, and 200-480 parts of inorganic heat-conducting powder C, wherein the component C is formed by mixing of spherical inorganic powder and non-spherical inorganic powder; the particle size of the spherical inorganic powder is 4-10 microns; the particle size of the non-spherical inorganic powder is 25-40 microns; and the weight ratio of the spherical powder to the non-spherical powder is (2.5-10) to 10. The preparation method of the casting rubber comprises the following steps: mixing the epoxy resin A with the anhydride curing agent B at the ratio; adding C to a mixture of A and B, mixing, and then defoaming; and casting and solidifying. The viscosity of the casting rubber is effectively lowered through compounding of the spherical powder and non-spherical powder of the component C and control of particle sizes; casting is facilitated; meanwhile, the thermal conductivity and the impact strength are obviously improved; the anti-sedimentation effect is good; and the casting rubber is free of a solvent in preparation and is free of environmental pollution.

Description

technical field [0001] The invention relates to the technical field of insulating materials, in particular to a low-viscosity heat-conducting epoxy casting glue and a preparation method thereof. Background technique [0002] Epoxy castables are one of the key materials required for the manufacture of transformers and reactors for power transmission and transformation equipment. The long-term operation of transformers and reactors leads to temperature rise, and the heat loss caused by dielectric loss under the action of electric field is easy to cause thermal breakdown of epoxy cast insulators. In order to quickly dissipate the heat generated during the operation of power transmission and transformation equipment, ensure the safety of products, and improve the service life, the insulation material industry is paying more and more attention to the insulation structure of power transmission and transformation equipment and the thermal conductivity of insulation materials. [0...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L63/02C08L63/04C08L63/00C08G59/42C08K13/04C08K7/18C08K3/22C08K3/36C08K3/38C08K3/28
Inventor 黄孙息冯羽风马纪翔青双桂
Owner GUILIN ELECTRICAL EQUIP SCI RES INST
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