Preparation method of tellurium copper compound nanometer material
A technology of nanomaterials and compounds, applied in the field of electrochemistry, can solve the problems that the amount of tellurium and copper cannot be accurately controlled, and the molar ratio of compounds is not easy to control, so as to achieve the effects of improving purity, reducing energy loss, and avoiding loss
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Embodiment 1
[0036]Ordinary quartz glass sheet is selected as the substrate, copper powder is evenly sprinkled on the quartz sheet, and put into the tube furnace. Set the target temperature to 950°C and bake for 30 minutes. A protective atmosphere is provided by blowing argon gas at a flow rate of 500 sccm. After reaching the set temperature, cool at a rate of 20°C / min. After the copper powder is cooled to room temperature, take it out, put it into the etchant and corrode it for 5s. After the copper powder was filtered out with filter paper, it was washed three times repeatedly with 18MΩ·cm deionized water. The composition ratio of the etchant is: H3PO4:CH3COOH:HNO3=50:28:22. Then put it into the replenishing solution to corrode for 3s. After the copper powder was filtered out with filter paper, it was washed three times repeatedly with 18MΩ·cm deionized water. The composition ratio of the replenishing solution is: NH3OH: H2O2: CH3CH2OH (anhydrous): H2O (DI) = 5:15:50:50. The obtaine...
Embodiment 2
[0038] The copper powder is placed in a crucible and placed in a tube furnace. The target temperature set is 850°C and baked for 1 hour. Nitrogen gas was supplied to provide a protective atmosphere, and the flow rate of nitrogen gas was 1 LPM. After reaching the set temperature, cool at a rate of 20°C / min. Continue to pass nitrogen gas for protection. After the copper powder is cooled to room temperature, take it out and put it into the etchant for 10 seconds. After the copper powder was filtered out with filter paper, it was washed three times repeatedly with 18MΩ·cm deionized water. The composition ratio of the etchant is: H3PO4:CH3COOH:HNO3=50:28:22. Then put it into the replenishing solution to corrode for 5s. After the copper powder was filtered out with filter paper, it was washed three times repeatedly with 18MΩ·cm deionized water. The composition ratio of the replenishing solution is: NH3OH: H2O2: CH3CH2OH (anhydrous): H2O (DI) = 15:5:50:50. The obtained copper p...
Embodiment 3
[0040] Choose ordinary mica sheet as the substrate, sprinkle copper powder evenly on the mica sheet, and put it into the tube furnace. The set target temperature is 1000°C and baked for 30 minutes. Introduce argon gas to provide a protective atmosphere. During the heating and cooling process, the flow rate of argon gas is 100 sccm, and the flow rate of argon gas is 1 LPM at the highest temperature. After baking for 30 minutes, it is then cooled at a rate of 20°C / min. After the copper powder is cooled to room temperature, take it out and put it into the etchant for 3s corrosion. After the copper powder was filtered out with filter paper, it was washed three times repeatedly with 18MΩ·cm deionized water. The composition ratio of the corrosive agent is: H 3 PO 4 :CH 3 COOH: HNO 3 =50:28:22. Then put it into the replenishing solution to corrode for 10s. After the copper powder was filtered out with filter paper, it was washed three times repeatedly with 18MΩ·cm deionized w...
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