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A Thermal Compensation Structure of a Release

A technology of thermal compensation and release, applied in the field of release, can solve the problems of poor release and insignificant bending change of working double metal.

Active Publication Date: 2017-11-28
XIAMEN HONGFA ELECTRICAL SAFETY & CONTROLS CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, in the cold winter, the external ambient temperature is low, sometimes as low as -10 to -20°C. Since the external ambient temperature will offset the heat generated by a part of the circuit overload, even if the circuit is overloaded, the bending change of the working double metal will not change. Obviously, there will be a problem of poor tripping

Method used

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  • A Thermal Compensation Structure of a Release
  • A Thermal Compensation Structure of a Release
  • A Thermal Compensation Structure of a Release

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Embodiment Construction

[0030] Please refer to Figure 1 to Figure 5 As shown, it shows the specific structure of the preferred embodiment of the present invention, which is a thermal compensation structure of the release, and its structure includes a bottom plate 10, a working double gold 20 installed on the bottom plate 10, and a compensation double gold 30 , connecting the transmission rod 40 between the working double gold 20 and the compensation double gold 30 , and the mechanism pull rod 50 that interferes with the compensation double gold 30 .

[0031] Wherein, the base plate 10 is provided with a working double gold mounting position 11, a compensation double gold mounting position 12, and a transmission rod mounting position 13, wherein the working double gold mounting position 11 is inside the base plate 10, and the compensation double gold mounting position 12 On the side of the bottom plate 10, the transmission rod mounting position 13 is between the above two double metal mounting positi...

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Abstract

The invention discloses a thermal compensation structure of a release. The thermal compensation structure comprises a bottom plate, a working bimetallic strip, a compensation bimetallic strip and a transmission rod, the working bimetallic strip and the compensation bimetallic strip are installed on the bottom plate and are opposite in bending direction when heated, the transmission rod is rotatably installed on the bottom plate, one end of the transmission rod is fixedly connected with the compensation bimetallic strip, the other end of the transmission rod is connected with the working bimetallic strip, a thermal insulation wall is arranged between the working bimetallic strip and the compensation bimetallic strip to separate the installation space of the working bimetallic strip from the installation space of the compensation bimetallic strip, and a convection hole communicated with the outside environment is formed in the independent space where the compensation bimetallic strip is located. Because of the design of the release, the influences of environment temperature variation on bending changes of the working bimetallic strip are counteracted through the compensation bimetallic strip, the releasing performance of a product is improved, and the environment temperature adaption range of the product is widened.

Description

technical field [0001] The invention relates to the technology in the field of trip units, in particular to a thermal compensation structure of the trip unit. Background technique [0002] The traditional release is to set the working double gold on the circuit. When the circuit is overloaded, heat will be generated. The working double gold will bend and change due to the overload temperature of the circuit, thereby triggering the action of the pull rod, so that the dynamic and static contacts of the contact mechanism of the circuit protector Separation, so as to play the role of overload protection. [0003] However, conventional working bi-metals cannot counteract the effect of bending due to ambient temperature. For example, in hot summer, the external environment is as high as 30-40°C. The working double metal is not only affected by the heat change caused by the circuit overload fault, but also affected by the external environment temperature. Therefore, even if the ci...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01H71/16
CPCH01H71/16
Inventor 王慧德
Owner XIAMEN HONGFA ELECTRICAL SAFETY & CONTROLS CO LTD
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