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Computer case with cooling function

A computer case and functional technology, applied in the direction of electrical digital data processing, digital processing power distribution, instruments, etc., can solve the problems of high heat generation of the computer system, failure to meet heat dissipation requirements, limited heat dissipation of the motherboard, etc., to increase the base area and improve Heat exchange efficiency, good noise absorption effect

Active Publication Date: 2018-11-13
周庆芬
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0002] With the continuous development of the electronic industry, the calorific value of the computer system is increasing. Simply installing a cooling fan on the central processing unit can no longer meet the cooling requirements.
The usual way in the industry to solve this problem is to install a cooling fan on the chassis to speed up the air convection in the chassis and improve the cooling efficiency.

Method used

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  • Computer case with cooling function
  • Computer case with cooling function
  • Computer case with cooling function

Examples

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Embodiment Construction

[0030] The present invention will be further described in detail below in conjunction with the accompanying drawings, so that those skilled in the art can implement it with reference to the description.

[0031] like Figure 1~3 As shown, the present invention provides a computer case with heat dissipation function, comprising: a case, which is a cuboid box body comprising a front plate 3, a rear plate 4, a top plate 1, a bottom plate 2 and a pair of side plates; the front plate 3 is provided with A plurality of first air holes, the inner diameter of the inlet end of each first air hole is smaller than the inner diameter of the air outlet end, wherein the front plate 3 is a wave plate, and the front plate is made of diatom mud; as image 3 As shown, that is, the aperture of each first air hole is from small to large, which plays a role in decelerating the flow velocity of the airflow. The gas discharged from the chassis enters the first air hole from the inlet end of the first...

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PUM

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Abstract

The invention discloses a computer case with a heat dissipation function. The computer case comprises the case, a fan group and a detection device, wherein the case is a rectangular case body which comprises a front plate, a rear plate, a top plate, a bottom plate and one pair of side plates; the front plate is provided with a plurality of first air holes; the fan group, a dust screen, a splitter plate, a mainboard fixing plate and one pair of flow baffles are successively arranged in the case; the fan group comprises a first fan and a second fan; and air flow blown from the fan group passes through the splitter plate via the dust screen to cool a mainboard fixed on the mainboard fixing plate, then passes through a gap between the mainboard fixing plate and the bottom plate, passes through the gap between one pair of flow baffles, and is discharged from the front plate; and the detection device comprises a temperature sensor, a moisture sensor, a first single chip microcomputer and a second single chip microcomputer. The computer case can quickly and intelligently cool the mainboard of the computer and is low in noise.

Description

technical field [0001] The invention relates to a computer case with heat dissipation function. Background technique [0002] With the continuous development of the electronic industry, the calorific value of the computer system is increasing. Simply installing a cooling fan on the central processing unit can no longer meet the cooling requirements. The usual way to solve this problem in the industry is to install a cooling fan on the case to accelerate the air convection in the case and improve the heat dissipation efficiency. However, a simple fan has limited heat dissipation to the motherboard and cannot meet people's needs. Contents of the invention [0003] It is an object of the present invention to solve at least the above-mentioned problems and to provide at least the advantages which will be described later. [0004] Another object of the present invention is to provide a computer case with heat dissipation function, which can quickly and intelligently cool down ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G06F1/18G06F11/30
CPCG06F1/181G06F11/3058
Inventor 王文强
Owner 周庆芬
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