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LED light source module based on chip scale package and LED lamp

A LED light source and chip-level packaging technology, applied in the field of optics, can solve the problems of low light efficiency, waste of materials, and affecting the widespread use of LED light source modules, and achieve the effect of reducing production costs and improving light efficiency

Active Publication Date: 2017-02-01
SHENZHEN CYT SEMICON TECH CO LTD
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  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Based on one or more of the above problems, the present invention provides an LED light source module based on chip-scale packaging to solve the low light efficiency and material Waste, a problem that affects the widespread use of LED light source modules based on chip-scale packaging

Method used

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  • LED light source module based on chip scale package and LED lamp
  • LED light source module based on chip scale package and LED lamp

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Embodiment Construction

[0020] The present invention will be described in detail below in conjunction with the accompanying drawings and embodiments. It should be noted that, if there is no conflict, the embodiments of the present invention and various features in the embodiments can be combined with each other, and all are within the protection scope of the present invention.

[0021] See figure 1 , figure 1 It is a schematic structural diagram of an LED light source module based on a chip-scale package in a preferred embodiment of the present invention. Such as figure 1 As shown, the LED light source module based on chip-scale packaging according to the preferred embodiment of the present invention includes: a substrate 1, a square lamp bead area 2 is provided in the middle of the substrate 1, and a plurality of The lamp beads 21 are arranged in a matrix, and the drive unit is arranged around the lamp bead area 2 . Wherein, the substrate 1 may be of regular or irregular geometric shapes such as...

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Abstract

The invention discloses an LED lamp and an LED light source module based on chip scale package, and belongs to the technical field of photoelectricity. The LED light source module based on chip scale package comprises a substrate. A square lamp bead area is arranged in the middle of the substrate. A plurality of lamp beads arranged in a matrix manner are arranged in the lamp bead area. A drive unit is arranged around the lamp bead area. In the lamp beads in the same line, the initial arrangement positions of the lamp beads in the odd columns offset leftwards by 1 / 8 to 1 / 5 compared with the initial arrangement positions of the lamp beads in the even columns. According to the LED light source module based on chip scale package, the square lamp bead area is arranged in the middle of the substrate, the multiple lamp beads are arranged in the lamp bead area in the specific matrix manner, and therefore the light efficiency can be improved, and the production cost can be reduced. The LED lamp and the LED light source module have the beneficial effects of saving materials and being low in cost.

Description

technical field [0001] The invention relates to the field of optical technology, in particular to an LED light source module based on chip scale packaging and an LED lamp with the LED light source module based on chip scale packaging. Background technique [0002] Due to the advantages of environmental protection, long service life, energy saving, stable performance, high luminous efficiency and small size, LED light sources have been widely used in various lighting fields, such as indoor lighting, automobiles, and consumer electronics. [0003] At present, with the rapid development of LED technology, LED light sources have been widely used in high-power lighting equipment. However, the current high-power lighting requires a large number of LEDs, some as many as hundreds. Recently, a kind of LED light source module has been widely used. The LED light source module includes a disc-shaped substrate and an LED drive circuit and LED lights are arranged on the disc-shaped subst...

Claims

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Application Information

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IPC IPC(8): F21K9/20F21V19/00F21V23/00F21Y105/10F21Y115/10
Inventor 张伟珊古道雄
Owner SHENZHEN CYT SEMICON TECH CO LTD
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