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A method and device for calculating hevc SAO

A computing device and computing module technology, applied in image communication, digital video signal modification, electrical components, etc., can solve problems such as complex hardware circuits, large hardware area, and high cost

Active Publication Date: 2020-01-10
FUZHOU ROCKCHIP SEMICON
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] For this reason, it is necessary to provide a HEVC SAO calculation method and device to solve the problems of existing SAO calculation devices, such as complex hardware circuits, large hardware area, high cost, and large power consumption.

Method used

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  • A method and device for calculating hevc SAO
  • A method and device for calculating hevc SAO
  • A method and device for calculating hevc SAO

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Embodiment Construction

[0040] In order to explain in detail the technical content, structural features, achieved goals and effects of the technical solution, the following will be described in detail in conjunction with specific embodiments and accompanying drawings.

[0041] see figure 1 , is a schematic diagram of an HEVC SAO computing device according to an embodiment of the present invention. The device includes an acquisition module 101, a serial number calculation module 102, an offset value determination module 103, a judgment module 104, an addition module 105 and an output module 106; the acquisition module 101 includes an original pixel acquisition module 111, a reference pixel acquisition module 121 and Code flow control command parameter acquisition module 131; the original pixel acquisition module 111 is connected to the serial number calculation module 102, the reference pixel acquisition module 131 is connected to the serial number calculation module 102, and the serial number calcula...

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Abstract

The invention discloses an HEVC (High Efficiency Video Coding) SAO (Sample Adaptive Offset) calculation method and an HEVC SAO calculation device. The device comprises an acquisition module, a serial number calculation module, an offset value determination module, a judgment module, an addition module, and an output module. First, offset values are calculated according to original pixels acquired by the acquisition module and reference pixels corresponding to the original pixel values. Then, the judgment module judges the pixel values or offset pixel values of the original pixels output and adopted finally according to the values of code flow control command parameters acquired. Thus, SAO decoding is completed by means of two-level pipelining. The speed of SAO decoding computation is increased. The steps of the SAO decoding computation process are greatly simplified. The hardware area of an SAO computation device is reduced in hardware circuit design, and therefore, the hardware cost is lowered. Therefore, the method and the device have a broad market prospect in the field of computer chips.

Description

technical field [0001] The present invention relates to the field of computer chips, in particular to a HEVC SAO calculation method and device. Background technique [0002] HEVC (High Efficiency Video Coding) is a next-generation video codec standard proposed by JCTVC, an organization jointly established by the International Telecommunications Organization (ITU) and the Motion Picture Experts Group (MPEG). The goal is to double the compression rate compared to the previous generation standard H.264 / AVC under the premise of the same visual effect. [0003] The SAO (Sample Adaptive Offset) module is an adaptive sample point compensation module. This module mainly obtains the offset value by comparing the original pixel value with the filtered pixel value, and then adds the offset value to the filtered pixel value. On the pixel value after processing, the distortion of the image is reduced, so that the reconstructed image has better quality and PSNR value (peak signal-to-nois...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H04N19/11H04N19/14H04N19/147
Inventor 张明懿
Owner FUZHOU ROCKCHIP SEMICON
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