Packaging structure, display panel, display device and manufacturing method

A packaging structure and display panel technology, which can be used in final product manufacturing, sustainable manufacturing/processing, semiconductor/solid-state device manufacturing, etc., and can solve problems such as poor packaging effect of flexible display panels, affecting the normal use of display panels, and device failure.

Active Publication Date: 2017-07-18
BOE TECH GRP CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0004] Although the above encapsulation structure plays a certain role in encapsulation, since the edge of the metal layer is a straight line, the contact position between the inorganic encapsulation layer and the metal layer is a linear structure, and the growth of the inorganic encapsulation layer on the edge of the metal layer presents a single

Method used

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  • Packaging structure, display panel, display device and manufacturing method
  • Packaging structure, display panel, display device and manufacturing method
  • Packaging structure, display panel, display device and manufacturing method

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Embodiment Construction

[0053] In order to make the above objectives, features and advantages of the present invention more obvious and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and specific embodiments.

[0054] In the description of the present invention, unless otherwise specified, "plurality" means two or more; the terms "upper", "lower", "left", "right", "inner", "outer" The orientation or positional relationship of other indications is based on the orientation or positional relationship shown in the drawings, which is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the pointed machine or component must have a specific orientation and The azimuth structure and operation cannot be understood as a limitation of the present invention.

[0055] In the description of the present invention, it should be noted that the terms "installation", "...

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Abstract

The invention provides a packaging structure, a display panel, a display device and a manufacturing method; a plurality of metal fringing and insulation grooves are arranged in the packaging structure, thus allowing an inorganic package layer to present diversity arrangement characteristics when growing on the metal layer edge, and preventing the single rule that no inorganic package layer grows in the existing method; the metal fringing and the insulation grooves are arranged, thus increasing water oxygen invasive resistances and an invasive path length, effectively blocking external water oxygen from invading the display panel, improving the packaging effect of the display panel, and prolonging the display panel service life.

Description

Technical field [0001] The present invention relates to the field of display technology, in particular to a packaging structure, a display panel, a display device and a manufacturing method thereof. Background technique [0002] The flexible display panel is a light and thin self-luminous display panel, which not only has a good display effect, but also can be bent to meet the requirements of the actual use environment. [0003] Existing flexible display panels generally include a flexible display substrate and an encapsulation structure layer provided on the surface of the flexible display substrate. Specifically, the encapsulation structure includes an insulating layer formed on the flexible display panel and formed on the surface of the insulating layer facing away from the flexible display panel. The metal layer, the inorganic encapsulation layer formed on the surface of the metal layer away from the insulating layer, the inorganic encapsulation layer realizes the sealing of th...

Claims

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Application Information

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IPC IPC(8): H01L51/52
CPCH10K50/844H10K50/8423H10K50/8445H10K2102/311H10K50/8426H10K59/122H10K71/00H10K77/111
Inventor 李云飞
Owner BOE TECH GRP CO LTD
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