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Method and device for releasing film layer stress of array substrate

A technology for array substrates and column substrates, applied in the field of releasing film layer stress of array substrates, can solve problems such as panel display unevenness, achieve the effect of ensuring product yield and reducing display defects

Active Publication Date: 2020-04-28
SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

After the box-forming process is completed, the stress between the internal film layers changes when an external force is applied, causing the performance of the device on the array substrate to drift to varying degrees (such as local pressure and other uneven pressure), causing the panel to appear Show Inequality Exceptions

Method used

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  • Method and device for releasing film layer stress of array substrate
  • Method and device for releasing film layer stress of array substrate
  • Method and device for releasing film layer stress of array substrate

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Embodiment Construction

[0037] In order to further illustrate the technical means adopted by the present invention and its effects, the following describes in detail in conjunction with preferred embodiments of the present invention and accompanying drawings.

[0038] see Figure 7 , the present invention provides a method for releasing film layer stress of an array substrate, comprising the following steps:

[0039] Step 1. Please refer to figure 1 , providing a flexible stage 1 and a stage curvature adjustment mechanism 3 connected with the stage 1 .

[0040] Specifically, the material of the stage 1 is rubber or resin material, and the stage curvature adjustment mechanism 3 can make the surface of the stage 1 bend and deform by providing different pulling or pushing forces for the stage 1 .

[0041] Step 2, see figure 1 and image 3 , providing an array substrate 2 , the length of the long side of the array substrate 2 is smaller than the length and width of the carrier 1 .

[0042] Specifica...

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Abstract

Disclosed are a method and a device for releasing film stress of an array substrate. The method for releasing film stress of an array substrate comprises putting an array substrate (2) on a holder (1) having a cambered surface, and then gradually changing the bending curvature of the cambered surface of the holder by means of a holder curvature adjusting mechanism (3), so as to make the array substrate bend to conform with the cambered surface of the holder under the action of gravity, the bending extent changing along with the change of the curvature of the cambered surface of the holder, such that each film of the array substrate bears uniform tensile stress or compressive stress, and finally the stress accumulated between each film during the preparation process of the array substrate is eventually released under the action of external forces, avoiding the impact on the performance of devices on the array substrate caused by external pressure in subsequent manufacturing procedures and usage, reduce imperfect display of a display panel, ensuring defect-free rate of the product.

Description

technical field [0001] The present invention relates to the field of display technology, in particular to a method and device for releasing film layer stress of an array substrate. Background technique [0002] With the development of display technology, liquid crystal displays (Liquid Crystal Display, LCD) and other flat display devices are widely used in mobile phones, televisions, personal Various consumer electronic products such as digital assistants, digital cameras, notebook computers, and desktop computers have become the mainstream of display devices. [0003] Most of the liquid crystal display devices currently on the market are backlight liquid crystal displays, which include a liquid crystal display panel and a backlight module. The working principle of the liquid crystal display panel is to place liquid crystal molecules between two parallel glass substrates. There are many vertical and horizontal small wires between the two glass substrates. The direction of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): G02F1/13
CPCG02F1/1303
Inventor 不公告发明人
Owner SHENZHEN CHINA STAR OPTOELECTRONICS SEMICON DISPLAY TECH CO LTD
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