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Shielding cover of electronic device, electronic device, and assembly method of shielding cover

An electronic device and assembly method technology, applied in the fields of magnetic field/electric field shielding, electrical components, etc., can solve the problems of laborious dismantling, structural limitations, etc., and achieve the effects of labor-saving disassembly process, convenient maintenance, and disassembly and disassembly.

Pending Publication Date: 2018-10-12
GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, due to structural limitations, the two-piece shielding cover in the related art is also relatively laborious when it is removed.

Method used

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  • Shielding cover of electronic device, electronic device, and assembly method of shielding cover
  • Shielding cover of electronic device, electronic device, and assembly method of shielding cover
  • Shielding cover of electronic device, electronic device, and assembly method of shielding cover

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Embodiment Construction

[0038] Embodiments of the present application are described in detail below, examples of which are shown in the drawings, wherein the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below by referring to the figures are exemplary, and are only for explaining the present application, and should not be construed as limiting the present application.

[0039] In the description of the present application, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", " Back", "Left", "Right", "Vertical", "Horizontal", "Top", "Bottom", "Inner", "Outer", "Clockwise", "Counterclockwise", "Axial", The orientation or positional relationship indicated by "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of descri...

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PUM

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Abstract

The invention discloses a shielding cover of an electronic device, the electronic device, and an assembly method of the shielding cover. The shielding cover comprises a bracket and a cover body; the bracket is adapted to be connected to a circuit board of the electronic device; the cover body is covered on the bracket; the cover body is connected with the bracket in a clamped mode; and the cover body is provided with a disassembly part, and the disassembly part is adapted to disassemble the cover body from the bracket when disassembling the shielding cover. According to the shielding cover ofthe electronic device provided by the embodiment of the invention, the cover body is connected with the bracket in a clamped mode, so that the shielding cover is detachable and the disassembly and maintenance are convenient; and besides, by setting the disassembly part, the disassembling process of the shielding cover is more labor-saving and convenient.

Description

technical field [0001] The present application relates to the technical field of electronic devices, in particular to a shielding cover of an electronic device, an electronic device and a method for assembling the shielding cover. Background technique [0002] In the design of electronic devices, various shielding covers are often used for signal shielding, waterproof, anti-collision, etc. The structures of the shielding covers are mainly divided into the following two types. One is an integrated shield, which has the advantages of one-time molding, convenient mounting, and no need to manually fasten the top cover 21, etc. The disadvantage is that it is difficult to maintain, because the whole of the shield is closed, if the components in the shield need to For maintenance, the bracket must be removed first, and the bracket is soldered to the circuit board of the electronic device. It is time-consuming and laborious to remove the bracket. After the maintenance is completed, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H05K9/00
CPCH05K9/0032
Inventor 覃华平
Owner GUANGDONG OPPO MOBILE TELECOMM CORP LTD
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